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MM74HCT138MX

Onsemi

MM74HCT138MX by Onsemi

MM74HCT138MX by Onsemi is a CMOS decoder with 50 ns propagation delay, 4 Amp max I (ol), and inverted output polarity. It is used in industrial applications requiring fast signal decoding and operates at temperatures ranging from -40 to 85 °C.

Median Price

$0.288

Lifecycle Status

Suppliers In-Stock

27

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1k+

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Arrow

USA . 628 parts In-Stock

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Mouser Electronics

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Adafruit Industries

USA . 100 parts In-Stock

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Rochester

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Farnell

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DigiKey

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Verical

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Chip1Stop

Japan . 5,281 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 1,794 parts In-Stock

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Nova Conductors

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DigiKey Marketplace

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Vyrian

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Global Solutions Electronics Company

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Lantek

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MRC Electronics

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Component Sense

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NAC Semi

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Corel Iberica Componentes, S.L.

Spain . 2,500 parts In-Stock

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Prism Electronics

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Anansix

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ComSIT Distribution GmbH

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ACDS - Activité Composants Distribution Service

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Sogenti Electronics

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Bristol Electronics

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Elcom Components

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Ampacity Inc.

Singapore . 12,523 parts In-Stock

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Semicontronic

India . 12,068 parts In-Stock

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Corphita

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Corohmni

South Africa . 270 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 4,004 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,212 parts In-Stock

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Perfect Parts

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Continental Prestige Electronics

USA . 28,392 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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GreenTree Electronics

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Kulean Microsystems

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Glotronic Ltd.

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SupplyDigital Components

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TANS Electronics

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UHIMA Technologies

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Problanco Electronics

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Overview

Experience the seamless precision and reliability of the MM74HCT138MX by Onsemi, a top-tier manufacturer in the field of Decoder & Drivers. This innovative product boasts a fast propagation delay of just 50ns, ensuring swift and efficient performance in various industrial applications. With a compact small outline package style and dual terminal position, this decoder provides optimal flexibility and ease of installation. Trust Onsemi's cutting-edge technology and quality craftsmanship to deliver exceptional value and unparalleled benefits to your projects. Elevate your designs with the MM74HCT138MX and experience superior quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the decoder & driver, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 50 ns

The low propagation delay of 50 ns ensures fast response times, making this decoder & driver ideal for applications that require quick signal processing.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this decoder & driver compatible with a wide range of systems and easy to integrate into existing circuits.

Maximum I (ol): 4 Amp

The high maximum output current of 4 Amp allows this decoder & driver to drive larger loads, making it versatile and suitable for a variety of applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this decoder & driver can withstand harsh environmental conditions, ensuring reliable performance in demanding applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making this decoder & driver energy-efficient and reliable in noisy environments.

Technical Specifications

Decoder & Drivers MM74HCT138MX attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Additional Features:

3 ENABLE INPUTS

Family:

HCT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

50 ns

Propagation Delay (tpd):

60 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MM74HCT138MX Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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