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MM74HC138N

Onsemi

MM74HC138N by Onsemi

MM74HC138N by Onsemi is a CMOS Decoder & Drivers with 16 terminals. It has a propagation delay of 50 ns at 4.5V, load capacitance of 50 pF, and max I (ol) of 4A. Ideal for industrial applications requiring inverted output polarity and operating temperatures from -40 to 85°C.

Median Price

$0.390

Lifecycle Status

Suppliers In-Stock

61

In-Stock Inventory

1k+

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Adafruit Industries

USA . 500 parts In-Stock

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$14.943

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$14.794

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DigiKey

USA . 198,334 parts In-Stock

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$0.330

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Rochester

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Verical

USA . 173,279 parts In-Stock

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Freelance Electronics

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Digiode

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Nova Conductors

Japan . 44 parts In-Stock

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Component Electronics Inc.

Canada . 920 parts In-Stock

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Corohmni

South Africa . 456 parts In-Stock

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Ampacity Inc.

Singapore . 124,070 parts In-Stock

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Corphita

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Aranea Global

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Continental Prestige Electronics

USA . 5,479 parts In-Stock

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Argo Parts USA

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$14.943

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$14.794

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$14.196

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Aztec Data Supply Inc.

USA . 1,756 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Overview

Enhance your electronic projects with the MM74HC138N decoder & driver by Onsemi. Known for their top-quality components, Onsemi delivers reliable and durable solutions for a wide range of applications. This versatile product offers fast propagation delay, low power consumption, and a wide supply voltage range, making it ideal for various circuit designs. Experience seamless integration and excellent performance with the MM74HC138N, a must-have for electronics enthusiasts and professionals alike. Elevate your projects with Onsemi's exceptional quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection, making this product suitable for various environments.

Propagation Delay At Nominal Supply: 50 ns

Low propagation delay ensures fast and efficient operation of the decoder & driver, making it ideal for time-sensitive applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement on circuit boards.

Nominal Supply Voltage / Vsup (V): 4.5

Operates at a standard supply voltage of 4.5V, ensuring compatibility with common power sources.

Load Capacitance (CL): 50 pF

Designed to work effectively with a load capacitance of 50 pF, making it suitable for various circuit configurations.

Power Supplies (V): 2/6

Compatible with power supply voltages ranging from 2V to 6V, providing versatility in different applications.

No. of Terminals: 16

Offers a sufficient number of terminals for connecting to other components and peripherals in a circuit.

Package Style (Meter): IN-LINE

In-line package style allows for space-efficient mounting on a PCB, maximizing design flexibility.

Maximum I (ol): 4 Amp

Capable of handling a maximum output current of 4A, making it suitable for driving various loads.

Propagation Delay (tpd): 252 ns

Overall low propagation delay ensures timely signal processing and output response.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in industrial and harsh environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables operation in both extreme cold and hot conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability, ensuring secure connections during assembly.

Terminal Position: DUAL

Dual terminal position allows for easy insertion and soldering on a PCB.

Maximum Seated Height: 5.08 mm

Low seated height enables compact and space-saving PCB designs.

Width: 7.62 mm

Narrow width facilitates integration into tight spaces or crowded PCB layouts.

Output Polarity: INVERTED

Inverted output polarity offers flexibility in signal processing and compatibility with various circuit configurations.

Minimum Supply Voltage (Vsup): 2 V

Can operate at a low minimum supply voltage of 2V, enabling efficient power management in the system.

Length: 19.305 mm

Moderate length allows for easy placement and routing in a circuit design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in demanding industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and reliable connections on a PCB.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for compatibility and ease of integration into various PCB layouts.

Maximum Supply Voltage (Vsup): 6 V

Capable of operating at a maximum supply voltage of 6V, allowing for flexibility in power supply options.

Technical Specifications

Decoder & Drivers MM74HC138N attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Additional Features:

3 ENABLE INPUTS

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

50 ns

Propagation Delay (tpd):

252 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MM74HC138N Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-229-4855, 5962012294855, 5962-99-795-7384, 5962997957384

NIIN

012294855, 997957384

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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