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SN74LV138APWG4

Texas Instruments

SN74LV138APWG4 by Texas Instruments

SN74LV138APWG4 by Texas Instruments is an 8-bit decoder with a propagation delay of 18 ns and inverted output polarity. It operates at a supply voltage range of 2V to 5.5V, making it suitable for industrial applications requiring fast signal decoding in compact designs. The package style is small outline, thin profile, shrink pitch, ideal for surface mount assembly with standard input conditioning.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 21,730 parts In-Stock

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Digiode

USA . 4,206 parts In-Stock

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Vyrian

USA . 2,330 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 546 parts In-Stock

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$17.917

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Parana Technologies

USA . 247 parts In-Stock

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$22.949

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$23.600

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247

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DigiPath Technology Company

USA . 196 parts In-Stock

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$25.269

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$23.248

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196

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ChromeModa Solutions

Germany . 6,578 parts In-Stock

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$25.785

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$21.144

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IDEA Electronic Components Group

UK . 164 parts In-Stock

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$25.785

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$24.496

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$23.206

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One Stop Electronics

USA . 1,218 parts In-Stock

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$59.000

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Microchip USA

USA . 4,585 parts In-Stock

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Corphita

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Overview

Looking for a reliable and high-quality decoder & driver? Look no further than the SN74LV138APWG4 by Texas Instruments! With its advanced technology and industrial-grade design, this product offers unparalleled performance and durability. Perfect for a wide range of applications, this decoder & driver is a valuable addition to any project. Trust Texas Instruments to provide you with the best quality components that deliver exceptional results every time. Elevate your designs with the SN74LV138APWG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the decoder & driver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 18 ns

Fast propagation delay allows for quick response times, making this decoder & driver ideal for high-speed applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Input Conditioning: STANDARD

Ensures compatibility with a wide range of input signals, making this product versatile and suitable for various applications.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a low nominal supply voltage, reducing power consumption and heat generation.

No. of Terminals: 16

Provides ample connectivity options for interfacing with other components, enhancing the versatility of the decoder & driver.

Output Polarity: INVERTED

Allows for easy integration with systems that require inverted logic signals, expanding the compatibility of this decoder & driver.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Decoder & Drivers SN74LV138APWG4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUT

Family:

LV/LV-A/LVX/H

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

18 ns

Propagation Delay (tpd):

25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LV138APWG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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