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5962-8994401EX

Texas Instruments

5962-8994401EX by Texas Instruments

The Texas Instruments 5962-8994401EX is a MIL-STD-883 compliant TTL Decoder & Driver with 16 terminals. It operates b/w -55 to 125 °C, with a propagation delay of 144 ns at Vsup of 5V. Ideal for military applications requiring true output polarity and standard input conditioning.

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Digiode

USA . 4,323 parts In-Stock

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Vyrian

USA . 3,798 parts In-Stock

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Native Components

USA . 627 parts In-Stock

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$0.226

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$0.217

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Northwest PG Solutions

USA . 1,699 parts In-Stock

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$0.248

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$0.219

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AZTECH Wire

Italy . 304 parts In-Stock

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$16.717

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Parana Technologies

USA . 695 parts In-Stock

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$16.762

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DigiPath Technology Company

USA . 1,897 parts In-Stock

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$18.457

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$16.981

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IDEA Electronic Components Group

UK . 1,254 parts In-Stock

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$18.834

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$17.892

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$16.951

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ChromeModa Solutions

Germany . 579 parts In-Stock

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$15.444

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One Stop Electronics

USA . 429 parts In-Stock

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Corphita

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Overview

Experience unparalleled quality and reliability with the Texas Instruments 5962-8994401EX Decoder & Drivers. Built to MIL-STD-883 standards, this product offers exceptional performance in a wide range of applications. With a nominal supply voltage of 5V and a fast propagation delay of 144ns, this decoder provides seamless operation even in extreme temperatures. Trust Texas Instruments to deliver cutting-edge technology and unmatched value to meet all your decoding needs.

Feature Benefit Bullets

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with other devices and easy integration into existing systems.

Screening Level: MIL-STD-883

MIL-STD-883 screening level ensures high reliability and performance in military applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting on circuit boards and efficient use of space.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V provides stable power for reliable operation.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options and increased functionality.

Package Style (Meter): IN-LINE

The in-line package style makes installation and assembly straightforward and efficient.

Propagation Delay (tpd): 144 ns

With a low propagation delay of 144ns, this decoder and driver offers fast data processing and output response times.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance in various environments and conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C enables operation in extreme cold conditions or industrial settings.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity for secure connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in installation and connection options for different applications.

Output Polarity: TRUE

True output polarity ensures compatibility with other components and correct signal processing.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V ensures that the decoder and driver can operate reliably even under slight voltage fluctuations.

Technology: TTL

TTL technology provides fast signal processing, low power consumption, and compatibility with a wide range of devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form offers secure and durable connections for long-lasting performance.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V ensures the decoder and driver's protection against overvoltage situations for enhanced durability.

Technical Specifications

Decoder & Drivers 5962-8994401EX attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

144 ns

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

5962-8994401EX Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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