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5962-8409201VEA

Texas Instruments

5962-8409201VEA by Texas Instruments

Texas Instruments' 5962-8409201VEA is a MILITARY-grade CMOS Decoder & Drivers with 51ns Propagation Delay, 16 terminals, and 5V Nominal Voltage. It features INVERTED output polarity and is ideal for military applications requiring high reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,978 parts In-Stock

1+ parts

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8,978

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Digiode

USA . 4,516 parts In-Stock

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4,516

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Distributors (Availability)

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AZTECH Wire

Italy . 513 parts In-Stock

1+ parts

$7.086

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-

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513

$7.086

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Parana Technologies

USA . 375 parts In-Stock

1+ parts

$12.320

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-

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$12.749

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375

$12.320

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$12.749

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DigiPath Technology Company

USA . 327 parts In-Stock

1+ parts

$13.566

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327

$13.566

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ChromeModa Solutions

Germany . 3,248 parts In-Stock

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$13.843

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$11.351

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3,248

$13.843

$11.351

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IDEA Electronic Components Group

UK . 1,102 parts In-Stock

1+ parts

$13.843

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$13.151

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$12.459

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1,102

$13.843

$13.151

$12.459

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One Stop Electronics

USA . 1,300 parts In-Stock

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$27.000

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$27.000

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Native Components

USA . 711 parts In-Stock

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$31.426

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$30.169

711

$31.426

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$30.169

Northwest PG Solutions

USA . 705 parts In-Stock

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$34.568

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705

$34.568

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Corphita

USA . 864 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the Texas Instruments 5962-8409201VEA Decoder & Drivers. Designed with precision and quality in mind, this product offers a seamless integration for various applications. Whether you're in the military or aerospace industry, rest assured that this decoder and drivers will exceed your expectations. With a MIL-PRF-38535 Class V screening level and a wide range of operating temperatures, this product ensures durability and efficiency. Trust Texas Instruments to deliver top-notch technology that provides value, benefits, and advantages to all customers. Elevate your projects with the 5962-8409201VEA today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed body material provides high durability and reliability, perfect for military grade applications.

Propagation Delay At Nominal Supply: 51 ns

The low propagation delay ensures fast response time, making this decoder and driver suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is commonly used in many electronic systems, making integration easier.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this decoder and driver can withstand harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for efficient and reliable operation.

Technical Specifications

Decoder & Drivers 5962-8409201VEA attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

51 ns

Propagation Delay (tpd):

255 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Driver

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

5962-8409201VEA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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