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5962-3832601BFX

Texas Instruments

5962-3832601BFX by Texas Instruments

The Texas Instruments 5962-3832601BFX is a TTL decoder & driver with 16 terminals, operating b/w -55 to 125°C. It has a propagation delay of 46ns and operates on a supply voltage range of 4.5V to 5.5V. Ideal for military-grade applications requiring true output polarity and totem pole characteristics in a flatpack package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,126 parts In-Stock

1+ parts

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6,126

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Digiode

USA . 4,381 parts In-Stock

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4,381

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Distributors (Availability)

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AZTECH Wire

Italy . 381 parts In-Stock

1+ parts

$17.546

100+ parts

-

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381

$17.546

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Parana Technologies

USA . 1,430 parts In-Stock

1+ parts

$21.115

100+ parts

-

1k+ parts

$21.377

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1,430

$21.115

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$21.377

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DigiPath Technology Company

USA . 2,033 parts In-Stock

1+ parts

$23.250

100+ parts

$21.390

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2,033

$23.250

$21.390

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ChromeModa Solutions

Germany . 5,586 parts In-Stock

1+ parts

$23.725

100+ parts

$19.454

1k+ parts

-

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5,586

$23.725

$19.454

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IDEA Electronic Components Group

UK . 343 parts In-Stock

1+ parts

$23.725

100+ parts

$22.539

1k+ parts

$21.352

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343

$23.725

$22.539

$21.352

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One Stop Electronics

USA . 1,059 parts In-Stock

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$25.000

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1,059

$25.000

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Native Components

USA . 206 parts In-Stock

1+ parts

$583.099

100+ parts

$571.437

1k+ parts

$565.606

10k+ parts

$559.775

206

$583.099

$571.437

$565.606

$559.775

Northwest PG Solutions

USA . 1,804 parts In-Stock

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$641.409

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1,804

$641.409

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Corphita

USA . 3,898 parts In-Stock

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3,898

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Overview

Unleash the power of the 5962-3832601BFX by Texas Instruments, a top-of-the-line Decoder & Drivers component that guarantees unmatched quality and reliability. Crafted with precision using advanced technology, this product is designed to meet the rigorous standards of military-grade applications. With a nominal supply voltage of 5V and a fast propagation delay of 46ns, this decoder offers lightning-fast performance in a compact flatpack package. Trust Texas Instruments to deliver cutting-edge solutions for all your decoding needs, ensuring optimal functionality and efficiency every step of the way. Elevate your projects with the 5962-3832601BFX and experience unparalleled performance like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection, ensuring reliability in various environments.

Surface Mount: YES

Convenient for automated assembly processes, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard voltage levels, making it easy to integrate into existing systems.

Propagation Delay (tpd): 46 ns

Fast response time ensures quick signal processing and high efficiency.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for industrial and harsh environments.

Technology: TTL

Uses TTL technology known for its reliability and simplicity, ensuring stable performance.

Technical Specifications

Decoder & Drivers 5962-3832601BFX attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDFP-F16

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

TOTEM POLE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

46 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

5962-3832601BFX Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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