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5962-8406201VEA

Texas Instruments

5962-8406201VEA by Texas Instruments

Texas Instruments 5962-8406201VEA is an 8-bit Decoder & Driver with a propagation delay of 45ns at 5V, suitable for MILITARY applications. It operates b/w -55 to 125 °C and has a max power supply current of 0.16mA. The package style is IN-LINE with dual terminal position and Tin/Lead finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,367 parts In-Stock

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Digiode

USA . 2,177 parts In-Stock

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2,177

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Distributors (Availability)

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Native Components

USA . 327 parts In-Stock

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$0.034

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$0.032

327

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$0.032

Parana Technologies

USA . 489 parts In-Stock

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$7.321

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$7.813

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$7.321

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DigiPath Technology Company

USA . 2,027 parts In-Stock

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$8.061

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$7.417

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$8.061

$7.417

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ChromeModa Solutions

Germany . 2,879 parts In-Stock

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$8.226

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$6.745

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$8.226

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IDEA Electronic Components Group

UK . 1,907 parts In-Stock

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$8.226

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$7.403

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AZTECH Wire

Italy . 306 parts In-Stock

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$12.950

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One Stop Electronics

USA . 1,043 parts In-Stock

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$36.000

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Corphita

USA . 2,516 parts In-Stock

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Northwest PG Solutions

USA . 2,263 parts In-Stock

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Microchip USA

USA . 2,065 parts In-Stock

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Overview

Unlock the power of precision with the 5962-8406201VEA by Texas Instruments, a top-tier manufacturer known for its cutting-edge technology and reliability. Designed for Decoder & Drivers applications, this high-quality product offers unmatched performance with a propagation delay of just 45 ns. Ideal for military-grade projects, this decoder ensures seamless operation in extreme conditions. With a nominal supply voltage of 5V and a maximum seated height of 5.08 mm, this product delivers exceptional value and efficiency to customers seeking superior solutions. Trust Texas Instruments for unparalleled quality and innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent durability and protection for the decoder & drivers, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 45 ns

Low propagation delay ensures fast response times, making this product efficient for time-critical applications.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage ensures compatibility with common power sources, simplifying integration.

No. of Bits: 8

8 bits allow for a wide range of inputs to be decoded, making this product versatile in handling multiple signals.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in harsh conditions, enhancing the product's performance and longevity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Technical Specifications

Decoder & Drivers 5962-8406201VEA attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

3 ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

270 ns

Qualification:

Qualified

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Driver

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

5962-8406201VEA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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