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5962-8406201VFX

Texas Instruments

5962-8406201VFX by Texas Instruments

The Texas Instruments 5962-8406201VFX is a MILITARY-grade CMOS Decoder & Drivers with INVERTED output polarity. It operates b/w -55 to 125 °C, with a propagation delay of 270 ns at Vsup of 5V. Suitable for applications requiring MIL-PRF-38535 Class V screening and standard input conditioning.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,976 parts In-Stock

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Digiode

USA . 5,395 parts In-Stock

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5,395

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Anansix

USA . 1,127 parts In-Stock

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1,127

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Distributors (Availability)

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Native Components

USA . 1,129 parts In-Stock

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$0.061

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-

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$0.058

1,129

$0.061

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$0.058

One Stop Electronics

USA . 1,035 parts In-Stock

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$4.000

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1,035

$4.000

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IDEA Electronic Components Group

UK . 2,048 parts In-Stock

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$15.133

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$13.620

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2,048

$15.133

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$13.620

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AZTECH Wire

Italy . 457 parts In-Stock

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$18.047

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457

$18.047

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DigiPath Technology Company

USA . 2,014 parts In-Stock

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$28.457

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2,014

$28.457

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MKK Technologies

India . 596 parts In-Stock

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$28.457

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596

$28.457

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ChromeModa Solutions

Germany . 5,884 parts In-Stock

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$29.703

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$24.356

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$29.703

$24.356

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Parana Technologies

USA . 2,682 parts In-Stock

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$18.094

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$18.094

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Northwest PG Solutions

USA . 2,561 parts In-Stock

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Corphita

USA . 1,715 parts In-Stock

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Overview

Enhance your electronic projects with the high-quality 5962-8406201VFX decoder and driver from Texas Instruments. Designed with precision and reliability in mind, this product is perfect for a wide range of applications. With its ceramic, glass-sealed package and military-grade screening level, you can trust that this decoder and driver will deliver exceptional performance even in challenging environments. Experience the value and benefits that Texas Instruments brings to the table with this versatile and innovative product.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package provides durability and protection for the internal components of the decoder & driver, ensuring reliability in various operating environments.

Surface Mount: YES

Being surface mountable makes the decoder & driver easy to integrate into electronic circuit designs, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is a commonly used standard in many electronic systems, making this decoder & driver compatible with a wide range of applications.

Propagation Delay (tpd): 270 ns

With a fast propagation delay of 270 ns, this decoder & driver can efficiently process input signals and deliver outputs with minimal delay, enhancing overall system performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows the decoder & driver to withstand elevated temperatures without degradation, suitable for demanding industrial or military applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, making this decoder & driver energy-efficient and versatile.

Technical Specifications

Decoder & Drivers 5962-8406201VFX attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

3 ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDFP-F16

Length:

10.2 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

270 ns

Qualification:

Qualified

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.73 mm

Trade Compliance

5962-8406201VFX Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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