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5962-8670101LX

Texas Instruments

5962-8670101LX by Texas Instruments

The Texas Instruments 5962-8670101LX is a MILITARY-grade CMOS Decoder & Driver with 24 terminals and a supply voltage range of 4.5V to 5.5V. It offers a fast propagation delay of 53ns, making it ideal for applications requiring quick signal processing in harsh environments like military and aerospace systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,672 parts In-Stock

1+ parts

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8,672

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Digiode

USA . 3,755 parts In-Stock

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3,755

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Distributors (Availability)

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AZTECH Wire

Italy . 277 parts In-Stock

1+ parts

$7.972

100+ parts

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277

$7.972

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One Stop Electronics

USA . 1,494 parts In-Stock

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$25.000

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1,494

$25.000

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Parana Technologies

USA . 954 parts In-Stock

1+ parts

$29.892

100+ parts

$2,775.883

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$26.902

10k+ parts

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954

$29.892

$2,775.883

$26.902

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DigiPath Technology Company

USA . 116 parts In-Stock

1+ parts

$32.914

100+ parts

$30.281

1k+ parts

-

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116

$32.914

$30.281

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ChromeModa Solutions

Germany . 2,134 parts In-Stock

1+ parts

$33.586

100+ parts

$27.541

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2,134

$33.586

$27.541

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IDEA Electronic Components Group

UK . 672 parts In-Stock

1+ parts

$33.586

100+ parts

$31.907

1k+ parts

$30.227

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672

$33.586

$31.907

$30.227

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Northwest PG Solutions

USA . 1,921 parts In-Stock

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1,921

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Corphita

USA . 1,871 parts In-Stock

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1,871

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Native Components

USA . 989 parts In-Stock

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989

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Overview

Enhance your electronic projects with the cutting-edge 5962-8670101LX by Texas Instruments. This top-tier Decoder & Drivers component, manufactured with precision and expertise, offers unmatched reliability and performance. Ideal for military-grade applications, this product ensures optimal functionality and durability even in extreme conditions. Upgrade your projects today with this high-quality solution that guarantees seamless operation and superior results. Trust Texas Instruments for innovative solutions that deliver exceptional value and efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and protection for the internal components of the decoder and driver, making it suitable for rugged applications.

Input Conditioning: STANDARD

Having standard input conditioning simplifies the integration and compatibility of the decoder and driver with various systems and components, ensuring ease of use.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 screening level ensures high reliability, quality, and performance of the decoder and driver in critical military and aerospace applications.

Nominal Supply Voltage / Vsup (V): 5

The use of a 5V nominal supply voltage offers compatibility with common power sources and ensures stable and reliable operation of the decoder and driver.

Propagation Delay (tpd): 53 ns

The low propagation delay of 53ns allows for fast signal processing and response times, making the decoder and driver suitable for time-sensitive applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the decoder and driver can withstand high-temperature environments, expanding its range of applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C ensures the decoder and driver can function reliably in extreme cold conditions, making it versatile in various environments.

Technology: CMOS

The use of CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing the performance and efficiency of the decoder and driver.

Technical Specifications

Decoder & Drivers 5962-8670101LX attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

2 ENABLE INPUTS

Family:

HCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T24

Logic IC Type:

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

53 ns

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

5962-8670101LX Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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