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74HCT138N,652

NXP Semiconductors

74HCT138N,652 by NXP Semiconductors

NXP Semiconductors' 74HCT138N,652 is a CMOS decoder with 53 ns propagation delay at 5V. It has 16 terminals, operates b/w -40 to 125 °C, and supports load capacitance of 50 pF. Widely used in automotive applications due to its inverted output polarity and standard input conditioning.

Median Price

$0.222

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Overview

Unlock the potential of your electronics projects with the 74HCT138N,652 by NXP Semiconductors. Known for its superior quality and reliability, NXP Semiconductors delivers top-notch products in the Decoder & Drivers category. This versatile component offers a wide range of applications, making it a valuable addition to any project. With a low propagation delay and high performance, this decoder provides optimal functionality for your designs. Trust NXP Semiconductors for innovative solutions that elevate your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 53 ns

Fast propagation delay allows for quick signal processing, making it suitable for time-sensitive applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common and stable supply voltage, making it compatible with a wide range of systems.

Terminal Position: DUAL

Dual terminal position allows for flexibility in mounting and installation options.

Output Polarity: INVERTED

Inverted output polarity can be advantageous for certain applications where an inverted signal is required.

Minimum Operating Temperature: -40 °C

Can operate in extremely low temperatures, making it suitable for outdoor or harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Decoder & Drivers 74HCT138N,652 attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Additional Features:

3 ENABLE INPUTS

Family:

HCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

53 ns

Propagation Delay (tpd):

53 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74HCT138N,652 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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