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NL7SZ19DFT2

Onsemi

NL7SZ19DFT2 by Onsemi

NL7SZ19DFT2 by Onsemi is a CMOS Decoder & Driver with 5.4 ns Propagation Delay, 1.8V Nominal Voltage, and 24 Amp Max I (ol). Ideal for industrial applications requiring fast signal processing in compact spaces due to its small outline package and low power consumption.

Median Price

$0.166

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,874 parts In-Stock

1+ parts

-

100+ parts

$0.172

1k+ parts

$0.143

10k+ parts

$0.127

8,874

-

$0.172

$0.143

$0.127

Verical

USA . 8,874 parts In-Stock

1+ parts

-

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$0.159

8,874

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$0.159

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.126

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10

$0.126

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Digiode

USA . 252 parts In-Stock

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$0.134

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$0.134

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DigiKey Marketplace

USA . 8,874 parts In-Stock

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Vyrian

USA . 8,851 parts In-Stock

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Speed Components Ltd

Israel . 950 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 8,859 parts In-Stock

1+ parts

$0.114

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-

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8,859

$0.114

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Argo Parts USA

USA . 4,516 parts In-Stock

1+ parts

$0.126

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-

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$0.122

4,516

$0.126

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$0.122

Corphita

USA . 1,228 parts In-Stock

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$0.127

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Corohmni

South Africa . 204 parts In-Stock

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$0.134

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Vigor

Singapore . 133 parts In-Stock

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$0.140

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$0.140

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AZTECH Wire

Italy . 583 parts In-Stock

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$8.910

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583

$8.910

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Continental Prestige Electronics

USA . 8,874 parts In-Stock

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$0.121

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SupplyDigital Components

Austria . 7,061 parts In-Stock

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TANS Electronics

Latvia . 5,012 parts In-Stock

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Kulean Microsystems

USA . 3,631 parts In-Stock

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Kepictronics

USA . 2,520 parts In-Stock

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Assy Fe

Spain . 2,520 parts In-Stock

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Problanco Electronics

Mexico . 1,055 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$0.123

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$0.119

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$0.117

500

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$0.123

$0.119

$0.117

UHIMA Technologies

Türkiye . 470 parts In-Stock

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Microchip USA

USA . 427 parts In-Stock

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Overview

Experience superior performance and reliability with the NL7SZ19DFT2 by Onsemi, a leading manufacturer in the industry. This decoder & driver offers lightning-fast propagation delay, ensuring swift response times for your applications. With a low nominal supply voltage of 1.8V and high load capacitance of 50pF, this product is perfect for a wide range of industrial uses. Trust in Onsemi's expertise to deliver top-quality components that provide unmatched value and benefits to our customers. Elevate your projects with the NL7SZ19DFT2 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the decoder & driver, making it suitable for a variety of applications.

Propagation Delay At Nominal Supply: 5.4 ns

The low propagation delay ensures fast processing speed, making this decoder & driver suitable for time-sensitive applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and space in the design.

Nominal Supply Voltage / Vsup (V): 1.8

The low supply voltage requirement of 1.8V makes this decoder & driver energy-efficient and suitable for low-power applications.

Maximum I (ol): 24 Amp

The high maximum output current of 24A allows this decoder & driver to drive high-powered components, increasing its versatility in different applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this decoder & driver is suitable for use in industrial environments where temperature fluctuations can occur.

Technology: CMOS

The CMOS technology used in this decoder & driver provides low power consumption and high noise immunity, making it reliable and efficient in various applications.

Technical Specifications

Decoder & Drivers NL7SZ19DFT2 attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.4 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

1.25 mm

Trade Compliance

NL7SZ19DFT2 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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