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SN74HC154NT

Texas Instruments

SN74HC154NT by Texas Instruments

The Texas Instruments SN74HC154NT is a CMOS decoder with 24 terminals and inverted output polarity. It has a propagation delay of 53 ns at 2/6V, load capacitance of 50 pF, and can handle a max I (ol) of 5.2A. Ideal for military-grade applications requiring fast signal decoding in temperature ranges from -55 to 125°C.

Median Price

$12.250

Lifecycle Status

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TEDSS.com

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Forefront Electronics and Design

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American Microsemiconductor Inc.

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Digiode

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Classic Components Corporation

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Bristol Electronics

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Prism Electronics

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Nova Conductors

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ICP Electronique

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LWI Electronics Inc

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ComSIT Distribution GmbH

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Manoshevitz Elec. Sales

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J & M Industries LLC

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Pegasus Components GmbH

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LittleDiode

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Electronic Expediters

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Parana Technologies

USA . 803 parts In-Stock

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DigiPath Technology Company

USA . 876 parts In-Stock

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ChromeModa Solutions

Germany . 5,282 parts In-Stock

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IDEA Electronic Components Group

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Ampacity Inc.

Singapore . 961 parts In-Stock

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AZTECH Wire

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One Stop Electronics

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Corohmni

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Continental Prestige Electronics

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Overview

Unlock the power of precision with the SN74HC154NT by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that exceed expectations. The SN74HC154NT is a versatile decoder & driver that offers fast propagation delay, making it perfect for a wide range of applications. With its durable plastic/epoxy package body and inverted output polarity, this product provides exceptional value and reliability. Trust Texas Instruments to bring you cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 53 ns

Low propagation delay ensures fast signal processing, making the product suitable for real-time applications.

Load Capacitance (CL): 50 pF

With a moderate load capacitance, the product can efficiently drive connected components without excessive power consumption.

Power Supplies (V): 2/6

Support for a wide range of power supplies allows flexibility in voltage requirements, making the product versatile for different applications.

No. of Terminals: 24

Sufficient terminals provide ample connectivity options, enabling the product to interface with multiple devices or components.

Maximum I (ol): 5.2 Amp

High output current capability allows the product to drive heavy loads without the risk of damage, ensuring reliable performance under varying conditions.

Maximum Operating Temperature: 125 °C

Wide operating temperature range enables the product to function in extreme environments, increasing its applicability across different industries.

Minimum Operating Temperature: -55 °C

Ability to operate at low temperatures makes the product suitable for use in various climate conditions, ensuring consistent performance in cold environments.

Output Polarity: INVERTED

Inverted output polarity provides flexibility in signal processing, allowing the product to interface with different types of components or systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in digital signal processing applications.

Technical Specifications

Decoder & Drivers SN74HC154NT attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T24

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

53 ns

Qualification:

Not Qualified

Sub-Category:

Decoder/Drivers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC154NT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-251-6064, 5962012516064

NIIN

012516064

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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