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SN74HCT139PWTE4

Texas Instruments

SN74HCT139PWTE4 by Texas Instruments

SN74HCT139PWTE4 by Texas Instruments is a CMOS Decoder & Drivers with 2 functions, 43 ns propagation delay at 5V. It features inverted output polarity, operates in industrial temperature range (-40 to 85 °C), and has a small outline package for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,225 parts In-Stock

1+ parts

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Digiode

USA . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,894 parts In-Stock

1+ parts

$8.959

100+ parts

$831.955

1k+ parts

$8.063

10k+ parts

-

1,894

$8.959

$831.955

$8.063

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AZTECH Wire

Italy . 841 parts In-Stock

1+ parts

$9.044

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841

$9.044

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DigiPath Technology Company

USA . 1,360 parts In-Stock

1+ parts

$9.865

100+ parts

$9.076

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1,360

$9.865

$9.076

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IDEA Electronic Components Group

UK . 817 parts In-Stock

1+ parts

$10.066

100+ parts

$9.563

1k+ parts

$9.059

10k+ parts

-

817

$10.066

$9.563

$9.059

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ChromeModa Solutions

Germany . 23 parts In-Stock

1+ parts

$10.066

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$8.254

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23

$10.066

$8.254

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One Stop Electronics

USA . 1,472 parts In-Stock

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$28.000

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1,472

$28.000

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Corphita

USA . 3,878 parts In-Stock

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Overview

Unlock the power of your electronics with the Texas Instruments SN74HCT139PWTE4 decoder and driver. Trusted by professionals worldwide, Texas Instruments is known for superior quality and innovation in the semiconductor industry. This versatile product is ideal for a wide range of applications, offering reliable performance and efficiency. Experience seamless operation and enhanced functionality with the SN74HCT139PWTE4, designed to meet your needs and exceed your expectations. Elevate your projects with this high-quality component from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material helps reduce the overall weight of the product, making it easier to handle and install.

Propagation Delay At Nominal Supply: 43 ns

This low propagation delay ensures fast response times, making this product suitable for applications requiring quick data processing.

Surface Mount: YES

Being surface mountable makes this product easy to mount on circuit boards, saving space and facilitating automated assembly processes.

No. of Functions: 2

With two functions in one, this decoder & driver offers versatility and efficiency in controlling multiple outputs.

Nominal Supply Voltage/Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with various electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance requirement simplifies the design of the circuit and improves the overall performance of the product.

Maximum I (ol): 4 Amp

With a high maximum output current capability, this decoder & driver can drive a wide range of loads without overheating or malfunctioning.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making this product efficient and reliable in various applications.

Technical Specifications

Decoder & Drivers SN74HCT139PWTE4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

HCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

43 ns

Propagation Delay (tpd):

43 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74HCT139PWTE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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