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MC14511BDWR2G

Onsemi

MC14511BDWR2G by Onsemi

MC14511BDWR2G by Onsemi is a CMOS Decoder & Driver with 16 terminals. It operates at a supply voltage range of 3-18V and has a propagation delay of 1440ns. Ideal for military applications due to its wide temperature range (-55 to 125°C) and small outline package style.

Median Price

$0.649

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,279 parts In-Stock

1+ parts

$0.597

100+ parts

$0.383

1k+ parts

$0.320

10k+ parts

$0.286

1,279

$0.597

$0.383

$0.320

$0.286

Chip1Stop

Japan . 1,279 parts In-Stock

1+ parts

$0.649

100+ parts

$0.459

1k+ parts

$0.435

10k+ parts

-

1,279

$0.649

$0.459

$0.435

-

Farnell

UK . 6,390 parts In-Stock

1+ parts

$0.767

100+ parts

$0.432

1k+ parts

$0.348

10k+ parts

$0.292

6,390

$0.767

$0.432

$0.348

$0.292

Mouser Electronics

USA . 647 parts In-Stock

1+ parts

$0.770

100+ parts

$0.440

1k+ parts

$0.339

10k+ parts

$0.331

647

$0.770

$0.440

$0.339

$0.331

DigiKey

USA . 945 parts In-Stock

1+ parts

$1.870

100+ parts

$0.765

1k+ parts

$0.379

10k+ parts

$0.367

945

$1.870

$0.765

$0.379

$0.367

Rochester

USA . 3,682 parts In-Stock

1+ parts

-

100+ parts

$0.433

1k+ parts

$0.359

10k+ parts

$0.320

3,682

-

$0.433

$0.359

$0.320

Verical

USA . 1,279 parts In-Stock

1+ parts

-

100+ parts

$0.383

1k+ parts

$0.320

10k+ parts

$0.286

1,279

-

$0.383

$0.320

$0.286

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,198 parts In-Stock

1+ parts

$0.336

100+ parts

-

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2,198

$0.336

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$0.513

100+ parts

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150

$0.513

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Flip Electronics

USA . 8,000 parts In-Stock

1+ parts

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8,000

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Semtec, LLC

USA . 3,000 parts In-Stock

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3,000

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Vyrian

USA . 2,102 parts In-Stock

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2,102

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ACDS - Activité Composants Distribution Service

France . 171 parts In-Stock

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Holdelec - ElecDif-Pro

France . 171 parts In-Stock

1+ parts

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Bristol Electronics

USA . 44 parts In-Stock

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Atlantic Semiconductor

USA . 44 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,142 parts In-Stock

1+ parts

$0.221

100+ parts

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3,142

$0.221

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Corphita

USA . 1,890 parts In-Stock

1+ parts

$0.319

100+ parts

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1,890

$0.319

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Corohmni

South Africa . 412 parts In-Stock

1+ parts

$0.354

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412

$0.354

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Argo Parts USA

USA . 2,129 parts In-Stock

1+ parts

$0.513

100+ parts

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1k+ parts

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10k+ parts

$0.497

2,129

$0.513

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-

$0.497

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.513

100+ parts

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1,000

$0.513

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Continental Prestige Electronics

USA . 5,896 parts In-Stock

1+ parts

$0.591

100+ parts

$0.333

1k+ parts

$0.268

10k+ parts

-

5,896

$0.591

$0.333

$0.268

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QUARKTWIN TECHNOLOGY LTD

USA . 16,586 parts In-Stock

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Perfect Parts

USA . 9,642 parts In-Stock

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Problanco Electronics

Mexico . 8,181 parts In-Stock

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Kulean Microsystems

USA . 6,526 parts In-Stock

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SupplyDigital Components

Austria . 3,072 parts In-Stock

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TANS Electronics

Latvia . 2,164 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 574 parts In-Stock

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574

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Overview

Experience superior performance and reliability with the MC14511BDWR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality products like this Decoder & Drivers category offering. With its latched input conditioning and true output polarity, this small outline package provides customers with quick propagation delays and a wide operating temperature range. Ideal for military-grade applications, the MC14511BDWR2G ensures seamless operation and efficiency, making it the perfect choice for your decoding and driving needs. Trust Onsemi for innovative solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures longevity and reliability of the product.

Surface Mount: YES

Easily mountable on printed circuit boards, saving space and simplifying assembly.

Input Conditioning: LATCHED

Latched input conditioning helps in maintaining stable signal integrity.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common power supply voltages, making it versatile.

Propagation Delay (tpd): 1440 ns

Low propagation delay ensures quick responses in decoding and driving signals.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for various operating environments.

Minimum Operating Temperature: -55 °C

Operational in extreme cold conditions, ensuring reliability in diverse settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Decoder & Drivers MC14511BDWR2G attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

CMOS

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

1440 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

MC14511BDWR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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