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MC14514BCP

Onsemi

MC14514BCP by Onsemi

MC14514BCP by Onsemi is a CMOS Decoder & Drivers with 1100 ns Propagation Delay, LATCHED Input Conditioning, and 5V Nominal Voltage. It is ideal for military applications requiring TRUE Output Polarity in a PLASTIC/EPOXY package with 24 terminals.

Median Price

$8.530

Lifecycle Status

Suppliers In-Stock

43

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1k+

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Component Electronics Inc.

Canada . 31 parts In-Stock

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American Microsemiconductor Inc.

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Forefront Electronics and Design

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Corohmni

South Africa . 75 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,376 parts In-Stock

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AZTECH Wire

Italy . 327 parts In-Stock

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Ampacity Inc.

Singapore . 473 parts In-Stock

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Semicontronic

India . 375 parts In-Stock

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Component Stockers USA

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Microchip USA

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UHIMA Technologies

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Infinite Electronics LLP (Excess)

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Overview

Unlock the power of precision with the MC14514BCP by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers high-quality Decoder & Drivers that are designed for reliability and efficiency. The MC14514BCP is a versatile solution for various applications, offering a seamless performance with a nominal supply voltage of 5V and a maximum operating temperature of 125°C. Experience enhanced functionality and seamless integration with the MC14514BCP, providing customers with unparalleled value and benefits for their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 1100 ns

Fast propagation delay ensures quick performance and response times in decoding and driving operations.

Input Conditioning: LATCHED

Latched input conditioning ensures stable and reliable input signals, reducing the risk of errors or signal loss.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a common and stable supply voltage of 5V, making it compatible with a wide range of applications.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing power consumption and improving overall efficiency of the product.

Maximum Operating Temperature: 125 °C

Capable of operating in high temperature environments, making it suitable for a variety of industrial and military applications.

Minimum Operating Temperature: -55 °C

Can function effectively in extreme cold conditions, ensuring reliable performance in harsh environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high noise immunity, and reliable operation, making it a cost-effective and efficient choice.

Technical Specifications

Decoder & Drivers MC14514BCP attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Additional Features:

ADDRESS LATCHES

Family:

4000/14000/40000

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e0

Length:

31.75 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.64 Amp

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

1100 ns

Propagation Delay (tpd):

1100 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15.24 mm

Trade Compliance

MC14514BCP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-516-9837, 5962005169837, 5962-01-262-7109, 5962012627109, 5962-01-381-0199, 5962013810199

NIIN

005169837, 012627109, 013810199

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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