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SN74LS49D

Texas Instruments

SN74LS49D by Texas Instruments

SN74LS49D by Texas Instruments is a TTL decoder with 14 terminals, operating at 5V. It has a propagation delay of 100ns and open-collector output characteristics. Ideal for applications requiring standard input conditioning and a load capacitance of 15pF, in commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,034 parts In-Stock

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4,034

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Vyrian

USA . 3,695 parts In-Stock

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3,695

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 500 parts In-Stock

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500

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Standard Data Resources

USA . 25 parts In-Stock

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25

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One Stop Electronics

USA . 285 parts In-Stock

1+ parts

$15.000

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285

$15.000

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AZTECH Wire

Italy . 705 parts In-Stock

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$17.094

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705

$17.094

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Parana Technologies

USA . 1,277 parts In-Stock

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$29.491

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$59.948

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1,277

$29.491

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$59.948

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DigiPath Technology Company

USA . 1,180 parts In-Stock

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$32.473

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$29.875

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1,180

$32.473

$29.875

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ChromeModa Solutions

Germany . 6,100 parts In-Stock

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$33.136

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$27.172

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$33.136

$27.172

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IDEA Electronic Components Group

UK . 1,166 parts In-Stock

1+ parts

$33.136

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$31.479

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$29.822

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1,166

$33.136

$31.479

$29.822

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Corphita

USA . 3,183 parts In-Stock

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Overview

Unlock the power of smart decoding with the SN74LS49D by Texas Instruments. Known for its superior quality and reliability, Texas Instruments delivers exceptional Decoder & Drivers products. This versatile component is perfect for a variety of applications, offering customers unmatched value and benefits. Experience seamless operation and efficiency with the SN74LS49D, designed to meet your needs with precision and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

The surface mount capability makes it easy to integrate this decoder & driver into various circuit designs, saving space and making assembly more efficient.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage requirement is common and easily obtainable, making it convenient to power this decoder & driver in a wide range of applications.

Propagation Delay (tpd): 100 ns

With a low propagation delay of 100ns, this decoder & driver can quickly respond to input signals, making it suitable for time-critical applications.

Output Characteristics: OPEN-COLLECTOR

The open-collector output allows for easy interfacing with other components, giving flexibility in connecting this decoder & driver to different parts of the circuit.

Technical Specifications

Decoder & Drivers SN74LS49D attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

BLANKING INPUT

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Load Capacitance (CL):

15 pF

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

15 mA

Propagation Delay (tpd):

100 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74LS49D Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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