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74HCT138BQ,115

NXP Semiconductors

74HCT138BQ,115 by NXP Semiconductors

NXP Semiconductors' 74HCT138BQ,115 is a CMOS decoder with 53ns propagation delay at 5V. It features inverted output polarity, 16 terminals, and operates in automotive-grade temperatures. Ideal for applications requiring standard input conditioning and a load capacitance of 50pF.

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6

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1k+

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USA . 175,000 parts In-Stock

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Microchip USA

USA . 2,735 parts In-Stock

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Aztec Data Supply Inc.

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AZTECH Wire

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Corohmni

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Overview

Unlock the power of advanced technology with the 74HCT138BQ,115 decoder & driver by NXP Semiconductors. This high-quality product offers unparalleled performance and reliability, perfect for a wide range of applications. From automotive to industrial uses, this chip carrier with a very thin profile provides fast propagation delay and inverted output polarity. Trust NXP Semiconductors to deliver top-notch products that meet your needs and exceed your expectations. Experience the difference with the 74HCT138BQ,115 and take your projects to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components of the decoder & driver.

Propagation Delay At Nominal Supply: 53 ns

The fast propagation delay of 53 ns ensures quick signal processing, making this decoder & driver ideal for applications requiring high-speed data transmission.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly and integration, saving time and effort during the manufacturing process.

Nominal Supply Voltage (Vsup): 5V

The 5V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility and ease of integration with existing circuitry.

Maximum I (ol): 4 Amp

With a maximum output current of 4 Amps, this decoder & driver can drive a variety of loads, making it versatile for different applications.

Operating Temperature: -40°C to 125°C

The wide operating temperature range of -40°C to 125°C allows this decoder & driver to function effectively in extreme temperature conditions, making it suitable for automotive applications.

Technology: CMOS

The CMOS technology used in this decoder & driver provides low power consumption, making it energy-efficient and suitable for battery-powered devices.

Technical Specifications

Decoder & Drivers 74HCT138BQ,115 attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Family:

HCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

3.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.1X.14,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

53 ns

Propagation Delay (tpd):

53 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.5 mm

Trade Compliance

74HCT138BQ,115 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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