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MM74HCT138N

Onsemi

MM74HCT138N by Onsemi

MM74HCT138N by Onsemi is a CMOS decoder & driver with 1 function. It has a propagation delay of 50 ns and operates at temperatures ranging from -40 to 85 °C. This IC is commonly used in industrial applications requiring standard input conditioning and inverted output polarity.

Median Price

$0.565

Lifecycle Status

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32

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1k+

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Component Electronics Inc.

Canada . 27 parts In-Stock

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TEDSS.com

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Nova Conductors

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Voyager Components

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Anansix

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Digiode

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Component Sense

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ComSIT Distribution GmbH

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Italy . 179 parts In-Stock

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Semi Source

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Mil-Aero Solutions, Inc.

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Holdelec - ElecDif-Pro

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CirComp Electronics, Inc.

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ACDS - Activité Composants Distribution Service

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Corohmni

South Africa . 416 parts In-Stock

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Argo Parts USA

USA . 1,867 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$0.598

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Continental Prestige Electronics

USA . 420 parts In-Stock

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Andel Nordic

Denmark . 4,067 parts In-Stock

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$8.730

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AZTECH Wire

Italy . 337 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,379 parts In-Stock

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Ampacity Inc.

Singapore . 575 parts In-Stock

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Semicontronic

India . 1,060 parts In-Stock

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$53.625

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Component Stockers USA

USA . 697 parts In-Stock

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Problanco Electronics

Mexico . 7,362 parts In-Stock

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TANS Electronics

Latvia . 5,996 parts In-Stock

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SupplyDigital Components

Austria . 2,909 parts In-Stock

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Authorized Procurement Solutions

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Glotronic Ltd.

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Kulean Microsystems

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Supply Digital

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UHIMA Technologies

Türkiye . 529 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 104 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Overview

Discover the MM74HCT138N, a high-quality decoder and driver by Onsemi. With its innovative design and reliable manufacturing process, Onsemi ensures that this product meets industry standards and delivers exceptional performance. The MM74HCT138N offers numerous applications in various industries, providing flexibility and versatility to your projects. Its value lies in its ability to simplify complex systems, reduce costs, and improve overall efficiency. Experience the benefits of this product, such as its fast propagation delay, wide temperature range, and inverted output polarity. Trust Onsemi and unlock the full potential of your designs with the MM74HCT138N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material ensures durability and resistance to various environmental conditions, making it a reliable choice for long-term use.

Input Conditioning: STANDARD

With standard input conditioning, this product can seamlessly integrate with other systems and devices, allowing for efficient and compatible operation.

No. of Functions: 1

This product offers a single function, simplifying its usage and making it ideal for straightforward applications.

Package Shape: RECTANGULAR

The rectangular package shape of this product enables easy placement and mounting, optimizing space utilization and facilitating convenient installation.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this product offers stable power input, ensuring consistent performance and reliability.

No. of Terminals: 16

The 16 terminals of this product provide versatile connectivity options, enabling seamless integration with other components and systems.

Package Style (Meter): IN-LINE

The in-line package style of this product allows for compact and space-saving design, which is particularly useful in applications with limited space availability.

Propagation Delay (tpd): 50 ns

With a propagation delay of 50 ns, this product ensures fast and efficient signal transmission, minimizing delays and optimizing system performance.

Maximum Operating Temperature: 85 °C

This product can operate at a maximum temperature of 85°C, making it suitable for use in demanding and high-temperature environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme cold conditions, making it versatile and suitable for various environments.

Terminal Position: DUAL

The dual terminal position of this product provides flexibility in installation and connection options, ensuring compatibility with different system configurations.

Maximum Seated Height: 5.08 mm

This product's maximum seated height of 5.08 mm contributes to its compact design, allowing for efficient space utilization in applications with size limitations.

Width: 7.62 mm

With a width of 7.62 mm, this product offers a compact form factor, enabling easy integration and space-efficient design.

Output Polarity: INVERTED

The inverted output polarity of this product allows for compatibility with systems or devices that require inverted or complementary signals, expanding its range of applications.

Minimum Supply Voltage (Vsup): 4.5 V

This product can operate reliably with a minimum supply voltage of 4.5V, providing flexibility and compatibility with various power sources.

Length: 19.305 mm

With a length of 19.305 mm, this product offers a compact yet sufficient size for accommodating its components, ensuring efficient design and easy integration.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade operation, this product can withstand harsh operating conditions, making it a reliable choice for demanding industrial applications.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption and high noise immunity, maximizing efficiency and performance in diverse applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form of this product enables secure and reliable connection, suitable for applications that require robust and stable connections.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this product allows for easy connection with widely available standard connectors, simplifying wiring and enhancing compatibility.

Maximum Supply Voltage (Vsup): 5.5 V

This product can tolerate a maximum supply voltage of 5.5V, providing a safe and reliable power input range for stable and consistent operation.

Technical Specifications

Decoder & Drivers MM74HCT138N attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

HCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

50 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MM74HCT138N Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-293-1173, 5962012931173

NIIN

012931173

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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