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SNJ54ALS538J

Texas Instruments

SNJ54ALS538J by Texas Instruments

SNJ54ALS538J by Texas Instruments is a 20-terminal TTL decoder with 3-STATE output. Operating temperature range from -55°C to 125°C makes it suitable for military applications. Packaged in ceramic, it offers high reliability and performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,489 parts In-Stock

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4,489

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Digiode

USA . 663 parts In-Stock

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663

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,716 parts In-Stock

1+ parts

$9.858

100+ parts

-

1k+ parts

$10.427

10k+ parts

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1,716

$9.858

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$10.427

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DigiPath Technology Company

USA . 160 parts In-Stock

1+ parts

$10.854

100+ parts

$9.986

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160

$10.854

$9.986

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IDEA Electronic Components Group

UK . 2,239 parts In-Stock

1+ parts

$11.076

100+ parts

$10.522

1k+ parts

$9.968

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-

2,239

$11.076

$10.522

$9.968

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ChromeModa Solutions

Germany . 1,501 parts In-Stock

1+ parts

$11.076

100+ parts

$9.082

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1,501

$11.076

$9.082

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One Stop Electronics

USA . 1,524 parts In-Stock

1+ parts

$17.000

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1,524

$17.000

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AZTECH Wire

Italy . 861 parts In-Stock

1+ parts

$19.757

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861

$19.757

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Corphita

USA . 468 parts In-Stock

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468

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Overview

Unlock the power of precision with the SNJ54ALS538J by Texas Instruments, a top-notch Decoder & Drivers component designed for high-performance applications. Crafted with quality ceramic material and military-grade technology, this product guarantees reliability in extreme conditions. With 3-STATE output characteristics and a wide temperature range, the SNJ54ALS538J offers unmatched versatility and efficiency. Trust Texas Instruments to deliver cutting-edge solutions that meet your needs and exceed your expectations. Elevate your projects with the exceptional value and benefits of the SNJ54ALS538J.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal properties, ensuring stable operation even at high temperatures.

Screening Level: 38535Q/M;38534H;883B

High screening levels ensure reliability and durability of the product, making it suitable for critical applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration within a circuit or system.

No. of Terminals: 20

Having 20 terminals provides flexibility in connectivity options, allowing for various configurations.

Package Style (Meter): IN-LINE

In-line package style makes it convenient for placement in a circuit or system, optimizing space usage.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for multiple output states, enhancing the versatility and functionality of the product.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and increased reliability in connectivity.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures operation in harsh environments and critical applications.

Technology: TTL

TTL technology offers fast response times and low power consumption, making it suitable for high-speed applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for sturdy connections and easy soldering, ensuring long-lasting performance.

Terminal Pitch: 2.54 mm

2.54 mm terminal pitch provides compatibility with standard PCB layouts and allows for easy integration within existing designs.

Technical Specifications

Decoder & Drivers SNJ54ALS538J attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

Logic IC Type:

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Decoder/Drivers

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNJ54ALS538J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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