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8406201EX

Texas Instruments

8406201EX by Texas Instruments

The Texas Instruments 8406201EX is a MILITARY-grade CMOS Decoder & Drivers with 16 terminals. It operates b/w -55 to 125 °C, with a supply voltage range of 2-6V. Featuring a propagation delay of 270ns, it is ideal for applications requiring INVERTED output polarity and standard input conditioning.

Median Price

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Lifecycle Status

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4

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1k+

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Vyrian

USA . 4,499 parts In-Stock

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Digiode

USA . 3,559 parts In-Stock

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Anansix

USA . 1,120 parts In-Stock

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Resion

USA . 2 parts In-Stock

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AZTECH Wire

Italy . 523 parts In-Stock

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$10.041

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Native Components

USA . 725 parts In-Stock

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$12.420

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Northwest PG Solutions

USA . 627 parts In-Stock

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$13.662

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$12.296

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One Stop Electronics

USA . 241 parts In-Stock

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$17.000

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Parana Technologies

USA . 1,952 parts In-Stock

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$20.390

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$1,893.512

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$18.351

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DigiPath Technology Company

USA . 2,261 parts In-Stock

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$22.452

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$20.656

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ChromeModa Solutions

Germany . 5,082 parts In-Stock

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$22.910

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IDEA Electronic Components Group

UK . 551 parts In-Stock

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$22.910

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551

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Corphita

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Overview

Discover the unmatched quality and precision of the 8406201EX by Texas Instruments, a cutting-edge Decoder & Drivers component designed for military-grade applications. With its ceramic, glass-sealed package and standard input conditioning, this product offers reliability and durability in extreme conditions. Ideal for demanding environments, this decoder provides fast propagation delay and inverted output polarity, ensuring seamless performance. Trust Texas Instruments to deliver top-notch technology that exceeds expectations, setting new standards for excellence in the industry. Elevate your projects with the 8406201EX and experience unrivaled value and efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and reliability, making this decoder and driver a suitable choice for rugged environments.

Input Conditioning: STANDARD

Standard input conditioning allows for compatibility with a wide range of input signals, making this decoder and driver versatile for various applications.

Screening Level: MIL-PRF-38535

The MIL-PRF-38535 screening level ensures high quality and reliability, meeting military standards for critical applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is common and widely available, making it easy to integrate this decoder and driver into existing systems.

Propagation Delay (tpd): 270 ns

With a fast propagation delay of 270 ns, this decoder and driver can quickly process input signals, making it suitable for time-sensitive applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows this decoder and driver to function reliably in harsh or high-temperature environments.

Technology: CMOS

The CMOS technology used in this decoder and driver offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Decoder & Drivers 8406201EX attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

3 ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT APPLICABLE

Propagation Delay (tpd):

270 ns

Qualification:

Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT APPLICABLE

Width:

7.62 mm

Trade Compliance

8406201EX Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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