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8406201XC

STMicroelectronics

8406201XC by STMicroelectronics

8406201XC by STMicroelectronics is a CMOS decoder/driver with a propagation delay of 54 ns and operates at a nominal voltage of 5 V. It features a ceramic, glass-sealed package and supports military-grade applications. Ideal for high-reliability systems, it withstands temperatures from -55 °C to 125 °C.

Median Price

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3

In-Stock Inventory

1k+

8406201XC by STMicroelectronics
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Digiode

USA . 3,824 parts In-Stock

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3,824

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Anansix

USA . 2,010 parts In-Stock

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2,010

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Vyrian

USA . 405 parts In-Stock

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405

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 233 parts In-Stock

1+ parts

$25.978

100+ parts

-

1k+ parts

$23.380

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233

$25.978

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$23.380

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Native Components

USA . 414 parts In-Stock

1+ parts

$35.400

100+ parts

-

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$33.984

414

$35.400

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$33.984

Northwest PG Solutions

USA . 1,821 parts In-Stock

1+ parts

$38.940

100+ parts

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1,821

$38.940

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MKK Technologies

India . 2,155 parts In-Stock

1+ parts

$48.850

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2,155

$48.850

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DigiPath Technology Company

USA . 2,155 parts In-Stock

1+ parts

$48.850

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2,155

$48.850

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Corphita

USA . 3,199 parts In-Stock

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3,199

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Parana Technologies

USA . 910 parts In-Stock

1+ parts

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$31.061

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910

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$31.061

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Overview

Elevate your projects with the 8406201XC from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance decoder and driver boasts exceptional reliability, making it perfect for military and industrial applications. Crafted with precision in a robust ceramic package, it ensures optimal durability and temperature resilience. Experience seamless integration and superior efficiency—unlocking endless possibilities for your designs while benefiting from STMicroelectronics’ legacy of excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed packaging provides excellent protection against environmental factors, making the product ideal for harsh conditions.

Propagation Delay At Nominal Supply: 54 ns

A low propagation delay at nominal supply ensures fast switching times, contributing to high-speed operation in digital circuits.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern PCBs, enhancing versatility.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a variety of signal types, making it easier to interface with other components.

Screening Level: 38535Q/M;38534H;883B

High screening levels ensure reliability and performance in mission-critical applications typical in military and aerospace environments.

Package Shape: RECTANGULAR

The rectangular package shape is conducive to organized layout on PCBs, facilitating efficient space utilization.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V is a standard in many electronics, ensuring compatibility with numerous existing circuits.

Load Capacitance (CL): 50 pF

A specified load capacitance contributes to predictable performance under various conditions, improving design reliability.

Power Supplies (V): 2/6

Flexible power supply requirements (2V to 6V) allow the product to be utilized in diverse applications with varying voltage levels.

No. of Terminals: 16

With 16 terminals, this product can support a broad range of functionality and configurations, accommodating complex circuit designs.

Package Style (Meter): FLATPACK

Flatpack style allows for low-profile mounting, making it suitable for space-constrained applications.

Maximum I (ol): 4 Amp

The ability to handle up to 4 Amps of output current supports high-power applications, enhancing its utility in demanding environments.

Propagation Delay (tpd): 270 ns

Although higher than the nominal delay, this propagation delay remains within efficient limits for standard applications, resulting in reliable performance.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature indicates suitability for high-temperature applications, making it reliable in extreme conditions.

Minimum Operating Temperature: -55 °C

The ability to function as low as -55 °C expands the range of applications to includes those in extremely cold environments.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options on the PCB, improving design possibilities.

Output Polarity: INVERTED

With inverted output polarity, this product can be directly integrated into systems that require such signals, improving system efficiency.

Minimum Supply Voltage (Vsup): 2 V

The minimum supply voltage of 2V allows it to operate effectively in low-power applications, enhancing energy efficiency.

Temperature Grade: MILITARY

Designed to military specifications, this product ensures high reliability and performance in defense and aerospace applications.

Technology: CMOS

CMOS technology ensures low power consumption, making it a cost-effective choice for battery-operated devices.

Terminal Form: FLAT

Flat terminal form simplifies PCB assembly, promoting consistent electronics manufacturing processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for efficient space use on PCBs and supports dense layouts.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6V provides additional flexibility in design, accommodating various power requirements.

Technical Specifications

Decoder & Drivers 8406201XC attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Additional Features:

3 ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDFP-F16

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

54 ns

Propagation Delay (tpd):

270 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

8406201XC Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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