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SN74LS156N

Texas Instruments

SN74LS156N by Texas Instruments

SN74LS156N by Texas Instruments is a TTL decoder with 4 bits and 2 functions. It has a propagation delay of 27 ns at 5V, open-collector output, and operates b/w 0-70°C. Commonly used in applications requiring standard input conditioning and inverted output polarity.

Median Price

$0.868

Lifecycle Status

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Adafruit Industries

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Farnell

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Mouser Electronics

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$0.613

Newark

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Element14

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Rochester

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DigiKey

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Corphita

USA . 5,540 parts In-Stock

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Semicontronic

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Argo Parts USA

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Netroflash

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Advanced Electronics

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Continental Prestige Electronics

USA . 978 parts In-Stock

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Microchip USA

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Germany . 6,831 parts In-Stock

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Overview

Upgrade your electronic projects with the high-quality SN74LS156N decoder and driver from Texas Instruments. This versatile component offers fast propagation delays, standard input conditioning, and open-collector output characteristics, making it ideal for a wide range of applications. With the reliability and expertise of Texas Instruments behind it, this product guarantees top-notch performance and durability. Embrace the value and benefits that the SN74LS156N brings to your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 27 ns

Low propagation delay ensures fast response times, making the product efficient in decoding and driving signals.

Input Conditioning: STANDARD

Standard input conditioning simplifies the integration of the product into existing systems.

No. of Functions: 2

Having multiple functions in a single device increases efficiency and reduces the need for additional components.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and organization in circuit designs.

No. of Bits: 4

A higher number of bits allows for greater precision in decoding and driving signals.

Nominal Supply Voltage / Vsup (V): 5

A standard supply voltage of 5V makes it compatible with common electronic systems.

Load Capacitance (CL): 15 pF

Low load capacitance ensures minimal interference and accurate signal processing.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable performance of the product.

No. of Terminals: 16

Sufficient number of terminals for connecting to external components and circuits.

Package Style (Meter): IN-LINE

In-line package style allows for easy integration in circuit layouts.

Maximum I (ol): 8 Amp

High maximum output current allows for driving a variety of loads.

Propagation Delay (tpd): 51 ns

Low propagation delay ensures fast and efficient signal processing.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for use in various environmental conditions.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for versatile signal driving configurations.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures product reliability in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable terminal finish for long-lasting performance.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options.

Maximum Seated Height: 5.08 mm

Compact size with low profile for space-constrained applications.

Width: 7.62 mm

Narrow width for efficient use of board space.

Output Polarity: INVERTED

Inverted output polarity for specific signal processing requirements.

Minimum Supply Voltage (Vsup): 4.75 V

Low minimum supply voltage allows for operation in low-power situations.

Length: 19.305 mm

Moderate length for accommodating multiple components on a circuit board.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures standard performance in common operating conditions.

Technology: TTL

TTL technology provides reliable signal processing and compatibility with TTL-based systems.

Terminal Form: THROUGH-HOLE

Through-hole terminal form for secure and stable connections.

Packing Method: TUBE

Tube packing method for safe storage and transportation of the product.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy soldering and connection to PCBs.

Maximum Supply Voltage (Vsup): 5.25 V

High maximum supply voltage tolerance for added protection against voltage spikes.

Maximum Power Supply Current (ICC): 10 mA

Low power supply current for energy-efficient operation.

Technical Specifications

Decoder & Drivers SN74LS156N attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

USABLE AS 1 TO 8 DEMULTIPLEXER

Family:

LS

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

51 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN74LS156N Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-064-1326, 5962010641326, 5962-01-322-3731, 5962013223731

NIIN

010641326, 013223731

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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