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SN74AS137J4

Texas Instruments

SN74AS137J4 by Texas Instruments

SN74AS137J4 by Texas Instruments is a TTL decoder with 16 terminals in a ceramic rectangular package. It operates b/w 0°C to 70°C, suitable for commercial applications. With dual terminal positions and through-hole technology, it's ideal for various decoding and driver tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,435 parts In-Stock

1+ parts

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7,435

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Digiode

USA . 1,615 parts In-Stock

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1,615

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 637 parts In-Stock

1+ parts

$9.101

100+ parts

-

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637

$9.101

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Parana Technologies

USA . 772 parts In-Stock

1+ parts

$20.995

100+ parts

-

1k+ parts

$21.219

10k+ parts

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772

$20.995

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$21.219

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DigiPath Technology Company

USA . 2,292 parts In-Stock

1+ parts

$23.118

100+ parts

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2,292

$23.118

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ChromeModa Solutions

Germany . 3,702 parts In-Stock

1+ parts

$23.590

100+ parts

$19.344

1k+ parts

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3,702

$23.590

$19.344

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IDEA Electronic Components Group

UK . 941 parts In-Stock

1+ parts

$23.590

100+ parts

$22.410

1k+ parts

$21.231

10k+ parts

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941

$23.590

$22.410

$21.231

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One Stop Electronics

USA . 620 parts In-Stock

1+ parts

$34.000

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620

$34.000

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Corphita

USA . 2,376 parts In-Stock

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2,376

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Overview

Enhance your electronic projects with the SN74AS137J4 by Texas Instruments, a top-tier manufacturer known for superior quality and reliability. This decoder & driver offers seamless integration and precision performance, making it ideal for a wide range of applications. Experience the value of smooth operation and efficient circuit control with this innovative product. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and brings your creations to life.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and helps in efficient heat dissipation, ensuring the longevity and reliability of the product.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and mounting in various electronic devices and systems.

No. of Terminals: 16

Having 16 terminals allows for multiple input and output connections, offering versatility in connectivity options.

Package Style (Meter): IN-LINE

In-line package style provides a streamlined and compact design, saving space in circuit layouts.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand high temperatures and perform reliably in demanding environments.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0 °C ensures the product's functionality in a wide range of temperature conditions.

Terminal Position: DUAL

Dual terminal position allows for easy and secure connection of wires or components, enhancing the overall stability of the product.

Temperature Grade: COMMERCIAL

Commercial temperature grade is suitable for standard commercial applications, making this product widely compatible and versatile.

Technology: TTL

TTL technology offers high-speed performance, low power consumption, and compatibility with a wide range of digital systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and are ideal for applications where reliability and stability are crucial.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this product allows for easy installation and connection, simplifying the assembly process.

Technical Specifications

Decoder & Drivers SN74AS137J4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Decoder/Drivers

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74AS137J4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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