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74HC138PW,112

NXP Semiconductors

74HC138PW,112 by NXP Semiconductors

NXP Semiconductors' 74HC138PW,112 is a CMOS decoder with 45 ns propagation delay and 225 ns tpd. It operates at -40 to 125 °C, with Vsup ranging from 2-6V. Ideal for automotive applications due to its inverted output polarity and small form factor.

Median Price

$0.132

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 50,714 parts In-Stock

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$0.146

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DigiKey

USA . 50,714 parts In-Stock

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Farnell

UK . 48,073 parts In-Stock

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Chip1Stop

Japan . 1,728 parts In-Stock

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Verical

USA . 406 parts In-Stock

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$0.096

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Arrow

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Digiode

USA . 3,020 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Chip Stock

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Vyrian

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Rapid Electronics

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IBS Electronics

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Anansix

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LIBRA Elektronik GmbH

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Ampacity Inc.

Singapore . 29,575 parts In-Stock

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$0.070

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Corphita

USA . 2,961 parts In-Stock

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Component Stockers USA

USA . 18,682 parts In-Stock

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$0.100

AZTECH Wire

Italy . 13,650 parts In-Stock

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Aranea Global

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Argo Parts USA

USA . 1,466 parts In-Stock

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Perfect Parts

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Continental Prestige Electronics

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UNI Independent Distributors

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Glotronic Ltd.

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Microchip USA

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GreenTree Electronics

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Overview

Unlock the power of precision with the 74HC138PW,112 by NXP Semiconductors. As a leading manufacturer in the semiconductor industry, NXP guarantees top-notch quality and reliability. This decoder and driver is versatile, making it ideal for a wide range of applications. With fast propagation delays and a compact package design, this product offers exceptional value to customers looking for efficient and effective solutions. Trust NXP Semiconductors to deliver excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the components inside, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 45 ns

Fast response time ensures quick and efficient signal processing.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it versatile for different applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for automotive and industrial settings.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Decoder & Drivers 74HC138PW,112 attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Additional Features:

3 ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74HC138PW,112 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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