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CD74HCT139E

Texas Instruments

CD74HCT139E by Texas Instruments

CD74HCT139E by Texas Instruments is a CMOS decoder with 2 functions, 4-bit input, and inverted output polarity. It operates at a nominal voltage of 5V with a propagation delay of 45ns. Ideal for military-grade applications requiring standard input conditioning and dual-terminal position in an inline package style.

Median Price

$0.510

Lifecycle Status

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Rochester

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Corphita

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DigiPath Technology Company

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Overview

Unlock the power of precision with the Texas Instruments CD74HCT139E decoder & driver. Designed with top-quality materials and advanced technology, this product delivers fast propagation delays and reliable performance in a compact package. Perfect for a wide range of applications, this versatile component offers customers exceptional value and efficiency. Stay ahead of the curve with Texas Instruments and experience the difference with the CD74HCT139E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the components inside, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 45 ns

Low propagation delay ensures fast and efficient processing of input signals, making this decoder & driver suitable for high-speed applications.

No. of Bits: 4

4 bits allow for a wide range of input combinations, making this decoder & driver versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage, this product can easily integrate into existing systems without the need for additional power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this decoder & driver can withstand harsh environmental conditions, making it reliable for industrial use.

Technical Specifications

Decoder & Drivers CD74HCT139E attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

HCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

51 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD74HCT139E Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-253-9991, 5962012539991

NIIN

012539991

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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