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CD74HC154M

Texas Instruments

CD74HC154M by Texas Instruments

CD74HC154M by Texas Instruments is a 16-bit decoder with a propagation delay of 44ns. It operates at a nominal voltage of 4.5V and has an inverted output polarity. This CMOS technology device is ideal for military-grade applications requiring fast signal decoding in compact spaces.

Median Price

$0.890

Lifecycle Status

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Chip1Stop

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Adafruit Industries

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Arrow

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Avnet

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Rochester

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Digiode

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Component Electronics Inc.

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Forefront Electronics and Design

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Flex Direct, LLC

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Prism Electronics

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Mil-Aero Solutions, Inc.

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

USA . 3,085 parts In-Stock

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Semicontronic

India . 1,269 parts In-Stock

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$0.679

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Parana Technologies

USA . 2,028 parts In-Stock

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$7.469

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$7.958

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DigiPath Technology Company

USA . 2,324 parts In-Stock

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$7.566

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UK . 301 parts In-Stock

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Advanced Electronics

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Netroflash

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Overview

Enhance your electronic projects with the Texas Instruments CD74HC154M decoder and driver, a high-quality component that offers precision and reliability. Manufactured by Texas Instruments, a trusted leader in the industry, this product is perfect for a wide range of applications. Its advanced technology ensures fast propagation delay, making it ideal for time-sensitive projects. With a compact design and easy surface mount installation, the CD74HC154M provides excellent value and performance. Upgrade your projects with this versatile component and experience the benefits of superior quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the decoder & drivers, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 44 ns

Low propagation delay allows for fast and efficient signal processing, making this product ideal for applications that require quick response times.

Surface Mount: YES

Surface mount capability enables easy and secure installation on circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures stable and consistent power delivery to the decoder & drivers, preventing voltage fluctuations that could affect performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and continue to function reliably in demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable for long-term use.

Technical Specifications

Decoder & Drivers CD74HC154M attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

2 ENABLE INPUTS

Family:

HC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

44 ns

Propagation Delay (tpd):

265 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

CD74HC154M Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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