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SN74HCT139D

Texas Instruments

SN74HCT139D by Texas Instruments

SN74HCT139D by Texas Instruments is a CMOS decoder with 2 functions, 4 bits, and inverted output polarity. It has a propagation delay of 43 ns at 5V supply voltage, suitable for industrial applications requiring standard input conditioning and surface mount capability. The package style is small outline with dual terminal position and Gull Wing form factor.

Median Price

$0.773

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

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Mouser Electronics

USA . 2,789 parts In-Stock

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Rochester

USA . 15,732 parts In-Stock

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DigiKey

USA . 15,732 parts In-Stock

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Verical

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Digiode

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Nova Conductors

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Vyrian

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PC Components Company LLC

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TME

Poland . 682 parts In-Stock

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Sea View Technologies

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Atlantic Semiconductor

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Mil-Aero Solutions, Inc.

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Elcom Components

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Classic Components Corporation

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Inland Empire Components Inc.

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Electronics Depot

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Electronic Expediters

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Ampacity Inc.

Singapore . 9,859 parts In-Stock

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Corphita

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Aranea Global

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Continental Prestige Electronics

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Argo Parts USA

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 2,884 parts In-Stock

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IDEA Electronic Components Group

UK . 744 parts In-Stock

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Corohmni

South Africa . 236 parts In-Stock

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Overview

Enhance the efficiency and reliability of your electronic projects with the SN74HCT139D by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers top-notch quality and innovation in their Decoder & Drivers category. This versatile product offers seamless integration, fast response times, and precise output control for your applications. With its high performance and advanced features, the SN74HCT139D provides exceptional value and benefits to customers seeking superior functionality and durability in their designs. Choose Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the decoder and drivers, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 43 ns

Fast propagation delay allows for quick response times in decoding and driving signals, ideal for time-sensitive applications.

Surface Mount: YES

Surface mount capability makes installation easier and more efficient, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making it easy to integrate into existing systems.

No. of Bits: 4

Offers sufficient bit capacity for decoding and driving signals, suitable for a wide range of applications.

Technical Specifications

Decoder & Drivers SN74HCT139D attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

HCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

43 ns

Propagation Delay (tpd):

43 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74HCT139D Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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