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SN74LVC1G19DBVR

Texas Instruments

SN74LVC1G19DBVR by Texas Instruments

SN74LVC1G19DBVR by Texas Instruments is a 3-STATE decoder with 5.2 ns propagation delay, ideal for industrial applications. It operates at a supply voltage range of 1.65V to 5.5V and has a max power supply current of 0.01 mA, making it suitable for low-power designs in compact spaces. With a small outline package style and standard input conditioning, this CMOS technology-based decoder offers high performance in temperature-sensitive environments.

Median Price

$0.178

Lifecycle Status

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22

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1k+

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Texas Instruments

USA . 148,289 parts In-Stock

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Chip1Stop

Japan . 2,194 parts In-Stock

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Arrow

USA . 2,577 parts In-Stock

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$0.096

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$0.081

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DigiKey

USA . 9,281 parts In-Stock

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$0.220

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$0.093

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$0.083

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$0.083

Mouser Electronics

USA . 3,498 parts In-Stock

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$0.097

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Rochester

USA . 4,000 parts In-Stock

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$0.083

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Verical

USA . 2,577 parts In-Stock

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$0.096

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RS (Exports)

UK . 25 parts In-Stock

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Digiode

USA . 387 parts In-Stock

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Nova Conductors

Japan . 61 parts In-Stock

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TME

Poland . 964 parts In-Stock

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$0.095

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$0.083

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Forefront Electronics and Design

USA . 1 parts In-Stock

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Vyrian

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DigiKey Marketplace

USA . 9,000 parts In-Stock

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R&J Components

USA . 4,821 parts In-Stock

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Sunrise Surplus Inc.

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Bristol Electronics

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Prism Electronics

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Sensible Micro Corp

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Right Parts Inc.

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Semi Source

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Semicontronic

India . 23,432 parts In-Stock

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$0.066

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$0.064

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Ampacity Inc.

Singapore . 23,432 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

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Corohmni

South Africa . 119 parts In-Stock

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Parana Technologies

USA . 1,405 parts In-Stock

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ChromeModa Solutions

Germany . 3,486 parts In-Stock

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IDEA Electronic Components Group

UK . 1,988 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Authorized Procurement Solutions

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DigiPath Technology Company

USA . 725 parts In-Stock

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Overview

Unlock the power of precision with the SN74LVC1G19DBVR by Texas Instruments. Designed with high-quality materials and advanced technology, this decoder & driver offers unmatched reliability and performance. Whether you're in need of fast propagation delay for critical applications or efficient low power consumption for energy-saving solutions, this product delivers. Trust Texas Instruments to provide top-notch products that meet your needs with excellence. Elevate your projects with the SN74LVC1G19DBVR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 5.2 ns

Fast propagation delay ensures efficient and quick signal processing in the decoder & driver circuit.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and enabling automated assembly processes.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low voltage, making it energy-efficient and suitable for applications with low power requirements.

Output Characteristics: 3-STATE

Offers flexibility in controlling the output state, allowing for high impedance output when not in use.

Technical Specifications

Decoder & Drivers SN74LVC1G19DBVR attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

16.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G19DBVR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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