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MC74HC138ADG

Onsemi

MC74HC138ADG by Onsemi

MC74HC138ADG by Onsemi is a 16-terminal CMOS decoder with 41ns propagation delay at 5V. It has inverted output polarity, operates b/w -55 to 125 °C, and is ideal for military-grade applications requiring standard input conditioning.

Median Price

$0.286

Lifecycle Status

Suppliers In-Stock

32

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 93 parts In-Stock

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Newark

USA . 300 parts In-Stock

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$0.294

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$0.271

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$0.484

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Farnell

UK . 919 parts In-Stock

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$0.615

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$0.272

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919

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Mouser Electronics

USA . 1,720 parts In-Stock

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Element14

Singapore . 85 parts In-Stock

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Rochester

USA . 65,237 parts In-Stock

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DigiKey

USA . 65,237 parts In-Stock

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Verical

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Arrow

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EBV Elektronik

Germany . 12,288 parts In-Stock

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RS (Exports)

UK . 5,087 parts In-Stock

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Chip1Stop

Japan . 4,072 parts In-Stock

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Master Electronics

USA . 2,016 parts In-Stock

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Freelance Electronics

USA . 90 parts In-Stock

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Digiode

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Nova Conductors

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TME

Poland . 350 parts In-Stock

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EXC GmbH

Germany . 94 parts In-Stock

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Component Electronics Inc.

Canada . 25 parts In-Stock

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Chip Stock

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Vyrian

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NAC Semi

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IBS Electronics

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Bristol Electronics

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Atlantic Semiconductor

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Corohmni

South Africa . 88 parts In-Stock

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Corphita

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Ampacity Inc.

Singapore . 12,202 parts In-Stock

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Semicontronic

India . 12,176 parts In-Stock

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Advanced Electronics

New Zealand . 93 parts In-Stock

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Argo Parts USA

USA . 665 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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Continental Prestige Electronics

USA . 1,958 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,282 parts In-Stock

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Perfect Parts

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Lixinc

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Latvia . 6,163 parts In-Stock

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Eastek

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SupplyDigital Components

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Problanco Electronics

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Speed Components Ltd (Excess)

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UHIMA Technologies

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Robosynatics

Brazil . 350 parts In-Stock

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Lucentia Tech

USA . 350 parts In-Stock

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iodParts Technologies Inc.

India . 240 parts In-Stock

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Kepictronics

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GreenTree Electronics

Israel . 50 parts In-Stock

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Kulean Microsystems

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Overview

Experience the superior quality of Onsemi with their MC74HC138ADG decoder & driver. This product offers fast propagation delay, inverted output polarity, and a wide operating temperature range, making it perfect for a variety of applications. With a compact design and standard input conditioning, this decoder & driver is easy to implement in your projects. Trust Onsemi for reliable performance and innovative technology that surpasses industry standards. Elevate your designs with the MC74HC138ADG and enjoy the benefits of precision engineering and exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the decoder & driver.

Propagation Delay At Nominal Supply: 41 ns

The low propagation delay ensures quick response and efficient operation of the decoder & driver.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this decoder & driver compatible with a wide range of applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the decoder & driver to function reliably in various environmental conditions.

Technology: CMOS

The CMOS technology used in this decoder & driver ensures low power consumption and high noise immunity, making it an efficient choice for circuit design.

Technical Specifications

Decoder & Drivers MC74HC138ADG attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

41 ns

Propagation Delay (tpd):

205 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC74HC138ADG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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