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CD74HC238PWR

Texas Instruments

CD74HC238PWR by Texas Instruments

CD74HC238PWR by Texas Instruments is an 8-bit decoder with a propagation delay of 30ns at 4.5V supply, suitable for military-grade applications. It features a max operating temperature of 125°C, surface mount capability, and a small outline package style.

Median Price

$0.234

Lifecycle Status

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28

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1k+

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Texas Instruments

USA . 42,462 parts In-Stock

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DigiKey

USA . 11,716 parts In-Stock

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Mouser Electronics

USA . 2,279 parts In-Stock

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Arrow

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Chip1Stop

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Rochester

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Verical

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Freelance Electronics

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Digiode

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Nova Conductors

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TME

Poland . 985 parts In-Stock

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Chip Stock

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Vyrian

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Bristol Electronics

USA . 2,586 parts In-Stock

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Prism Electronics

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ACDS - Activité Composants Distribution Service

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ComSIT Distribution GmbH

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Connector Distribution Corp

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Right Parts Inc.

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Inventory MP

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Semtec, LLC

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Ampacity Inc.

Singapore . 29,435 parts In-Stock

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Semicontronic

India . 29,261 parts In-Stock

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Corphita

USA . 4,297 parts In-Stock

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Continental Prestige Electronics

USA . 4,895 parts In-Stock

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Argo Parts USA

USA . 2,142 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Advanced Electronics

New Zealand . 450 parts In-Stock

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Parana Technologies

USA . 1,697 parts In-Stock

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DigiPath Technology Company

USA . 2,306 parts In-Stock

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ChromeModa Solutions

Germany . 3,560 parts In-Stock

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IDEA Electronic Components Group

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Corohmni

South Africa . 42 parts In-Stock

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Perfect Parts

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Lixinc

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GreenTree Electronics

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Glotronic Ltd.

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Overview

Elevate your electronics projects with the Texas Instruments CD74HC238PWR Decoder & Drivers. Crafted with precision and reliability in mind, this decoder boasts a fast propagation delay of 30 ns, making it ideal for applications that require quick response times. Whether you're a seasoned engineer or a hobbyist looking to level up your DIY game, this versatile component offers unmatched value with its compact design, wide operating temperature range, and low power consumption. Trust Texas Instruments to deliver quality products that bring your creations to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 30 ns

Low propagation delay ensures fast processing of signals, making this decoder and driver responsive and efficient.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, simplifying the installation process.

Nominal Supply Voltage / Vsup (V): 4.5

Works efficiently at a common supply voltage, making it compatible with a wide range of applications.

Temperature Grade: MILITARY

Designed to operate in extreme temperature conditions, making it suitable for demanding military applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, ensuring reliable performance.

Technical Specifications

Decoder & Drivers CD74HC238PWR attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE LOW AND ONE ACTIVE HIGH ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

CD74HC238PWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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