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74VHC138MTCX

Onsemi

74VHC138MTCX by Onsemi

74VHC138MTCX by Onsemi is a CMOS decoder with 11.5 ns propagation delay, 3.3 V nominal voltage, and 50 pF load capacitance. It is used in industrial applications requiring inverted output polarity and operates within -40 to 85 °C temperature range.

Median Price

$0.454

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DigiKey

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$0.231

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$0.231

Newark

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$0.546

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$0.301

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Mouser Electronics

USA . 6,260 parts In-Stock

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$1.130

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$0.442

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6,260

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$0.229

Adafruit Industries

USA . 47 parts In-Stock

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$27.028

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$24.355

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47

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Flip Electronics (Authorized)

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Rochester

USA . 13,465 parts In-Stock

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Arrow

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Verical

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Chip1Stop

Japan . 3,095 parts In-Stock

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$0.479

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$0.465

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Farnell

UK . 1,949 parts In-Stock

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Element14

Singapore . 1,949 parts In-Stock

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$0.430

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Maritex

Poland . 394 parts In-Stock

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Digiode

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Nova Conductors

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Bristol Electronics

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4,138

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$0.155

Component Electronics Inc.

Canada . 3,528 parts In-Stock

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$0.770

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$0.580

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Flip Electronics

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DigiKey Marketplace

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Vyrian

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Chip Stock

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NAC Semi

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IBS Electronics

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Dan-Mar Components

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Electro Mavin

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Rebound Electronics

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M&R Communications

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Semicontronic

India . 11,790 parts In-Stock

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$0.194

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$0.189

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$0.188

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Ampacity Inc.

Singapore . 11,211 parts In-Stock

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Corphita

USA . 1,127 parts In-Stock

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Component Stockers USA

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Argo Parts USA

USA . 2,421 parts In-Stock

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$0.316

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Netroflash

USA . 500 parts In-Stock

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$0.316

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$0.310

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$0.316

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Aztec Data Supply Inc.

USA . 1,588 parts In-Stock

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$20.662

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Corohmni

South Africa . 44 parts In-Stock

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$27.780

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Advanced Electronics

New Zealand . 47 parts In-Stock

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$29.701

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$27.028

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$24.355

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47

$29.701

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Metaverse IC Inc.

Canada . 110,250 parts In-Stock

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Perfect Parts

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Kepictronics

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Continental Prestige Electronics

USA . 18,655 parts In-Stock

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TANS Electronics

Latvia . 8,046 parts In-Stock

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Microchip USA

USA . 6,049 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

USA . 3,947 parts In-Stock

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SupplyDigital Components

Austria . 3,804 parts In-Stock

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Authorized Procurement Solutions

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Cyclops Electronics Ltd (Excess)

UK . 2,399 parts In-Stock

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Supply Digital

USA . 2,280 parts In-Stock

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Glotronic Ltd.

UK . 1,970 parts In-Stock

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Problanco Electronics

Mexico . 1,409 parts In-Stock

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UHIMA Technologies

Türkiye . 645 parts In-Stock

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Kulean Microsystems

USA . 287 parts In-Stock

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Overview

Unlock the power of innovation with the 74VHC138MTCX by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their products. The 74VHC138MTCX falls under the Decoder & Drivers category, offering unparalleled performance with a fast propagation delay of 11.5 ns. With a wide range of applications, this product is designed to meet the needs of professionals across various industries. Experience the value and benefits that this decoder brings, from its inverted output polarity to its industrial-grade temperature tolerance. Trust Onsemi for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this decoder & driver lightweight and durable.

Propagation Delay At Nominal Supply: 11.5 ns

With a fast propagation delay, this product ensures quick and efficient data processing.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation of the decoder & driver on circuit boards.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact design, saving space in the overall system layout.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes this product suitable for a wide range of applications.

Load Capacitance (CL): 50 pF

With a low load capacitance, this decoder & driver can drive external components efficiently.

Power Supplies (V): 2/5.5

Compatible with power supplies ranging from 2V to 5.5V, offering flexibility in system design.

No. of Terminals: 16

The 16 terminals provide ample connectivity options for interfacing with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design enhance the product's portability and ease of integration.

Maximum I (ol): 8 Amp

Capable of handling a maximum output current of 8A, making it suitable for driving high-power loads.

Propagation Delay (tpd): 18 ns

With a low propagation delay, this decoder & driver ensures minimal signal latency for improved performance.

Maximum Operating Temperature: 85 °C

Able to operate at temperatures up to 85°C, making it suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Can operate in temperatures as low as -40°C, ensuring reliability in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

With dual terminal positions, this product offers increased flexibility in circuit board layout.

Maximum Seated Height: 1.2 mm

The low maximum seated height allows for a slim and compact overall system design.

Width: 4.4 mm

With a width of 4.4mm, this product is suitable for applications where space is limited.

Output Polarity: INVERTED

The inverted output polarity offers versatility in signal processing and compatibility with different system configurations.

Minimum Supply Voltage (Vsup): 2 V

Able to operate at a minimum supply voltage of 2V, making it suitable for low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering during installation.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperatures of up to 260°C, ensuring robustness during assembly processes.

Length: 5 mm

With a length of 5mm, this product offers a compact footprint for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring reliability in demanding operating conditions.

Technology: CMOS

Utilizing CMOS technology, this decoder & driver offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and easy soldering during assembly.

Packing Method: TR

The TR packing method ensures safe and secure packaging for transportation and storage.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65mm, this product offers precise and secure connections on the circuit board.

Maximum Supply Voltage (Vsup): 5.5 V

Operating within a maximum supply voltage of 5.5V, ensuring compatibility with a wide range of power sources.

Technical Specifications

Decoder & Drivers 74VHC138MTCX attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Additional Features:

3 ENABLE INPUTS

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

18 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74VHC138MTCX Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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