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74VHC139MTCX

Onsemi

74VHC139MTCX by Onsemi

74VHC139MTCX by Onsemi is a decoder & driver IC with 10.5 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 3.3V, has 16 terminals in a small outline package, and features inverted output polarity.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,500 parts In-Stock

1+ parts

$0.281

100+ parts

$0.218

1k+ parts

$0.182

10k+ parts

-

2,500

$0.281

$0.218

$0.182

-

DigiKey

USA . 849 parts In-Stock

1+ parts

$0.590

100+ parts

$0.324

1k+ parts

$0.280

10k+ parts

$0.257

849

$0.590

$0.324

$0.280

$0.257

Mouser Electronics

USA . 530 parts In-Stock

1+ parts

$0.590

100+ parts

$0.324

1k+ parts

$0.281

10k+ parts

$0.264

530

$0.590

$0.324

$0.281

$0.264

Rochester

USA . 68,984 parts In-Stock

1+ parts

-

100+ parts

$0.311

1k+ parts

$0.258

10k+ parts

$0.230

68,984

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$0.311

$0.258

$0.230

Verical

USA . 31,104 parts In-Stock

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$0.288

31,104

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$0.288

Chip1Stop

Japan . 5,000 parts In-Stock

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$0.282

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$0.204

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$0.195

5,000

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$0.282

$0.204

$0.195

Distributors (In-Stock)

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Digiode

USA . 1,549 parts In-Stock

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$0.242

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1,549

$0.242

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Vyrian

USA . 2,206 parts In-Stock

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$0.255

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2,206

$0.255

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ComSIT Distribution GmbH

Germany . 21,600 parts In-Stock

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21,600

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ComSIT USA

USA . 15,000 parts In-Stock

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Bristol Electronics

USA . 2,514 parts In-Stock

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2,514

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Atlantic Semiconductor

USA . 2,214 parts In-Stock

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R&J Components

USA . 2,162 parts In-Stock

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Anansix

USA . 2,121 parts In-Stock

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Sensible Micro Corp

USA . 786 parts In-Stock

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786

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Prism Electronics

USA . 485 parts In-Stock

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485

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PC Components Company LLC

USA . 300 parts In-Stock

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300

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Semi Source

USA . 30 parts In-Stock

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30

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Distributors (Availability)

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Ampacity Inc.

Singapore . 29,520 parts In-Stock

1+ parts

$0.217

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29,520

$0.217

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Corphita

USA . 2,768 parts In-Stock

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$0.230

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2,768

$0.230

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Corohmni

South Africa . 460 parts In-Stock

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$0.255

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460

$0.255

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Native Components

USA . 189 parts In-Stock

1+ parts

$1,236.335

100+ parts

$1,211.608

1k+ parts

$1,199.245

10k+ parts

$1,186.882

189

$1,236.335

$1,211.608

$1,199.245

$1,186.882

Northwest PG Solutions

USA . 733 parts In-Stock

1+ parts

$1,359.968

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733

$1,359.968

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Continental Prestige Electronics

USA . 68,984 parts In-Stock

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$0.590

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68,984

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$0.590

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Perfect Parts

USA . 25,200 parts In-Stock

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Lixinc

USA . 19,662 parts In-Stock

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S.R.D Solutions

India . 7,500 parts In-Stock

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SupplyDigital Components

Austria . 6,434 parts In-Stock

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TANS Electronics

Latvia . 6,360 parts In-Stock

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Microchip USA

USA . 3,291 parts In-Stock

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Supply Digital

USA . 2,645 parts In-Stock

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Problanco Electronics

Mexico . 2,599 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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UHIMA Technologies

Türkiye . 713 parts In-Stock

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713

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Kulean Microsystems

USA . 533 parts In-Stock

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533

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Kepictronics

USA . 85 parts In-Stock

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Overview

Elevate your electronic projects with the 74VHC139MTCX by Onsemi, a top-tier manufacturer known for delivering premium quality components. This decoder and driver package offers lightning-fast propagation delay, versatile surface-mount capabilities, and reliable operation in industrial-grade temperatures. Perfect for applications requiring precision and efficiency, this product ensures optimal performance while providing customers with exceptional value and peace of mind. Upgrade to Onsemi's 74VHC139MTCX and experience unparalleled reliability and functionality in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protects the internal components of the decoder and driver from external factors.

Propagation Delay At Nominal Supply: 10.5 ns

The low propagation delay ensures fast signal processing and efficient operation of the decoder and drivers.

Surface Mount: YES

The surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making it versatile for various applications.

No. of Functions: 2

Having multiple functions in a single device offers cost-effectiveness and space-saving benefits in the circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V is common in many applications, ensuring widespread compatibility.

Load Capacitance (CL): 50 pF

The low load capacitance helps in achieving faster response times and reduced power consumption.

Power Supplies (V): 2/5.5

The wide range of power supply options allows flexibility in usage and compatibility with different voltage sources.

No. of Terminals: 16

Having 16 terminals provides ample connection points for interfacing with other components and peripherals in the circuit.

Maximum I (ol): 8 Amp

The high maximum output current of 8A enables driving larger loads without external amplification.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the decoder and drivers can function accurately even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the decoder and drivers energy-efficient and reliable.

Technical Specifications

Decoder & Drivers 74VHC139MTCX attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

AHC/VHC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74VHC139MTCX Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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