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74VHC139MTC

Onsemi

74VHC139MTC by Onsemi

74VHC139MTC by Onsemi is a CMOS Decoder & Drivers with 10.5 ns Propagation Delay, suitable for industrial applications. It features Inverted Output Polarity, operates at 3.3V Nominal Voltage, and has a max Operating Temperature of 85 °C.

Median Price

$0.214

Lifecycle Status

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1k+

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Arrow

USA . 135 parts In-Stock

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DigiKey

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Rochester

USA . 6,113 parts In-Stock

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$0.355

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Verical

USA . 2,350 parts In-Stock

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Chip1Stop

Japan . 135 parts In-Stock

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Vyrian

USA . 2,551 parts In-Stock

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Digiode

USA . 2,747 parts In-Stock

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ComSIT Distribution GmbH

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ComSIT USA

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Electronic Expediters

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LIBRA Elektronik GmbH

Germany . 653 parts In-Stock

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R&J Components

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North Shore Components

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Anansix

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Halfin

Belgium . 94 parts In-Stock

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Mentor Electronics Marketing, LLC

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Sogenti Electronics

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Manoshevitz Elec. Sales

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Prism Electronics

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Corohmni

South Africa . 382 parts In-Stock

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Corphita

USA . 2,330 parts In-Stock

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Native Components

USA . 478 parts In-Stock

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Northwest PG Solutions

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QUARKTWIN TECHNOLOGY LTD

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Kulean Microsystems

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Continental Prestige Electronics

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TANS Electronics

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Problanco Electronics

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GreenTree Electronics

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Overview

Unlock the power of advanced decoding and driving with the 74VHC139MTC from Onsemi. As a leading manufacturer in the industry, Onsemi delivers superior quality and reliability in every product. This versatile decoder & driver is designed for a wide range of applications, offering customers unparalleled performance and efficiency. With fast propagation delay and high output current, this product provides exceptional value and benefits to meet your needs. Upgrade your projects with the 74VHC139MTC and experience the advantages of cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection to the internal components of the decoder & drivers, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 10.5 ns

The low propagation delay at nominal supply voltage ensures fast signal processing and response times, making this product suitable for applications requiring quick data transfer.

Surface Mount: YES

Being surface mountable, this decoder & drivers can easily be mounted on PCBs, saving space and providing ease of assembly in electronic circuit designs.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V makes it compatible with a wide range of electronic systems, providing flexibility in integration.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high-temperature environments, making it suitable for industrial applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, enhancing the overall performance and efficiency of the decoder & drivers.

Technical Specifications

Decoder & Drivers 74VHC139MTC attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

AHC/VHC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74VHC139MTC Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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