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74VHC138SJ

Onsemi

74VHC138SJ by Onsemi

74VHC138SJ by Onsemi is a CMOS Decoder & Driver with 16 terminals and a supply voltage range of 2-5.5V. It features an inverted output polarity, 18ns propagation delay, and operates in industrial temperature grades. Ideal for applications requiring standard input conditioning and fast signal processing in compact designs.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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Flip Electronics

USA . 20,097 parts In-Stock

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Vyrian

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Anansix

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Digiode

USA . 1,332 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,081 parts In-Stock

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Semi Source

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Native Components

USA . 794 parts In-Stock

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$0.870

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Northwest PG Solutions

USA . 931 parts In-Stock

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$0.957

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Ampacity Inc.

Singapore . 19,923 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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SupplyDigital Components

Austria . 2,489 parts In-Stock

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Perfect Parts

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Glotronic Ltd.

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Corphita

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Kulean Microsystems

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TANS Electronics

Latvia . 1,995 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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UHIMA Technologies

Türkiye . 742 parts In-Stock

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Corohmni

South Africa . 393 parts In-Stock

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Metaverse IC Inc.

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Problanco Electronics

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Overview

Discover the exceptional performance and reliability of the 74VHC138SJ by Onsemi, a leading manufacturer in the industry. This versatile decoder & driver is perfect for a wide range of applications, offering high-quality output and efficiency. With a compact package body material and surface mount design, this product delivers unparalleled value and benefits to customers. Experience the advantages of this top-of-the-line technology and elevate your projects to new heights with the 74VHC138SJ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protects the internal components of the decoder and driver, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and making the product suitable for various applications.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V is commonly used in many electronic devices, making this decoder and driver compatible with a wide range of systems.

Propagation Delay (tpd): 18 ns

The low propagation delay of 18ns ensures fast and efficient signal processing, making this product ideal for applications requiring quick response times.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this decoder and driver can operate reliably in harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this decoder and driver energy-efficient and robust against interference.

Technical Specifications

Decoder & Drivers 74VHC138SJ attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

Length:

10.1 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

18 ns

Maximum Seated Height:

2.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

74VHC138SJ Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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