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74HCT4514N

NXP Semiconductors

74HCT4514N by NXP Semiconductors

The NXP Semiconductors 74HCT4514N is a CMOS Decoder & Drivers with 24 terminals. It operates at a nominal voltage of 5V and has a propagation delay of 83ns. With latched input conditioning, it is commonly used in automotive applications due to its true output polarity and max operating temperature of 125°C.

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Vyrian

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Ampacity Inc.

Singapore . 894 parts In-Stock

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AZTECH Wire

Italy . 14,392 parts In-Stock

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One Stop Electronics

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Overview

Enhance your electronic projects with the 74HCT4514N by NXP Semiconductors! As a leading manufacturer in the industry, NXP delivers top-notch quality and reliability. This decoder & driver is versatile, making it perfect for a wide range of applications. With fast propagation delay and latched input conditioning, this product ensures efficient performance. Experience the value and benefits that this component offers, from its easy integration to its exceptional output polarity. Upgrade your projects today with the 74HCT4514N and unlock endless possibilities!

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to damage, ensuring the longevity of the product.

Propagation Delay At Nominal Supply - 69 ns

Low propagation delay ensures fast and efficient operation of the decoder & drivers, making it suitable for time-sensitive applications.

Nominal Supply Voltage / Vsup (V) - 5

Operating at a nominal supply voltage of 5V makes this product compatible with a wide range of systems and applications.

Load Capacitance (CL) - 50 pF

The low load capacitance of 50 pF helps in reducing power consumption and improving the overall efficiency of the product.

Maximum Operating Temperature - 125 °C

With a high maximum operating temperature of 125°C, this product can withstand extreme heat conditions, making it suitable for various environments.

Technical Specifications

Decoder & Drivers 74HCT4514N attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Additional Features:

ADDRESS LATCHES

Family:

HCT

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e2

Length:

31.7 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

69 ns

Propagation Delay (tpd):

83 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

74HCT4514N Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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