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74VHCT138AMTCX

Onsemi

74VHCT138AMTCX by Onsemi

74VHCT138AMTCX by Onsemi is a CMOS Decoder & Driver with 13ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 5V and has inverted output polarity. This surface-mount device features a small outline package with 16 terminals and standard input conditioning.

Median Price

$0.305

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DigiKey

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Verical

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Chip1Stop

Japan . 15,000 parts In-Stock

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Rochester

USA . 13,396 parts In-Stock

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Digiode

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Flip Electronics

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Bristol Electronics

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Cyclops Electronics Ltd

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Ampacity Inc.

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Overview

Unlock the power of precision decoding with the 74VHCT138AMTCX by Onsemi. As a trusted leader in the industry, Onsemi delivers top-quality products that exceed expectations. The 74VHCT138AMTCX is perfect for applications requiring fast response times and reliable performance. With a nominal supply voltage of 5V and a low propagation delay of 13ns, this decoder offers unmatched efficiency and accuracy. Say goodbye to delays and errors with the 74VHCT138AMTCX - the smart choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the internal components of the decoder & drivers.

Propagation Delay: 13 ns

Fast propagation delay ensures quick processing of signals, making this product suitable for applications requiring high speed data transmission.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying assembly process.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard voltage of 5V, ensuring compatibility with most electronic systems.

Output Polarity: INVERTED

Inverted output polarity provides flexibility in signal processing and compatibility with a wide range of systems and devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy efficient and reliable for long-term use.

Technical Specifications

Decoder & Drivers 74VHCT138AMTCX attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Additional Features:

3 ENABLE INPUTS

Family:

AHCT/VHCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74VHCT138AMTCX Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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