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CD74HCT154M96E4

Texas Instruments

CD74HCT154M96E4 by Texas Instruments

CD74HCT154M96E4 by Texas Instruments is a 24-terminal decoder with a propagation delay of 53ns at 5V, suitable for military-grade applications. It features inverted output polarity, standard input conditioning, and operates within a temperature range of -55 to 125°C. The package is small outline with surface mount capability and terminal finish in nickel palladium gold.

Median Price

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Lifecycle Status

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1k+

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Vyrian

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Digiode

USA . 1,108 parts In-Stock

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Nova Conductors

Japan . 92 parts In-Stock

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One Stop Electronics

USA . 596 parts In-Stock

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AZTECH Wire

Italy . 521 parts In-Stock

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Parana Technologies

USA . 464 parts In-Stock

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IDEA Electronic Components Group

UK . 106 parts In-Stock

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ChromeModa Solutions

Germany . 96 parts In-Stock

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Ampacity Inc.

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Corphita

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DigiPath Technology Company

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Overview

Unlock the power of precision with the CD74HCT154M96E4 by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The CD74HCT154M96E4 belongs to the Decoder & Drivers category, offering fast propagation delay and inverted output polarity. Perfect for military-grade applications, this decoder promises seamless performance and efficient operation. Elevate your projects with the trusted brand and cutting-edge technology of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good durability and resistance to environmental factors, making this product suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 53 ns

Low propagation delay ensures fast response times, making this decoder and driver efficient for time-critical operations.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with various signal types, making this product versatile and adaptable to different system requirements.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V simplifies power management and integration with other components in the system.

Load Capacitance (CL): 50 pF

Optimal load capacitance helps in stable operation and reduces signal distortion, improving overall performance.

Width: 7.5 mm

Compact width allows for high-density mounting, ideal for space-constrained applications.

Maximum Seated Height: 2.65 mm

Low profile design saves vertical space and facilitates efficient airflow for thermal management.

Output Polarity: INVERTED

Inverted output polarity may be advantageous for specific applications where complementary logic signals are required.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Technical Specifications

Decoder & Drivers CD74HCT154M96E4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

2 ENABLE INPUTS

Family:

HCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

53 ns

Propagation Delay (tpd):

53 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

CD74HCT154M96E4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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