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CD74ACT138MG4

Texas Instruments

CD74ACT138MG4 by Texas Instruments

CD74ACT138MG4 by Texas Instruments is a 16-terminal decoder with a propagation delay of 12ns at 5V supply. It features inverted output polarity, CMOS technology, and operates in temperatures ranging from -55 to 125°C. Ideal for applications requiring fast decoding and driving capabilities in military-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,857 parts In-Stock

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Vyrian

USA . 2,294 parts In-Stock

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Ashlea Components Ltd

UK . 27 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Parana Technologies

USA . 68 parts In-Stock

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$11.349

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$11.776

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68

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$11.776

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AZTECH Wire

Italy . 857 parts In-Stock

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$11.987

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DigiPath Technology Company

USA . 1,419 parts In-Stock

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$12.497

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$11.497

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IDEA Electronic Components Group

UK . 825 parts In-Stock

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$12.752

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$12.114

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$11.477

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825

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ChromeModa Solutions

Germany . 650 parts In-Stock

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$12.752

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$10.457

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One Stop Electronics

USA . 186 parts In-Stock

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$19.000

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Ampacity Inc.

Singapore . 911 parts In-Stock

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$44.000

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Continental Prestige Electronics

USA . 6,033 parts In-Stock

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Argo Parts USA

USA . 4,970 parts In-Stock

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Corphita

USA . 3,008 parts In-Stock

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Bastille Electronics

Australia . 650 parts In-Stock

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Overview

Experience top-quality performance with the CD74ACT138MG4 by Texas Instruments, a leading manufacturer in the industry. This versatile decoder & driver is ideal for a wide range of applications, offering fast propagation delay and standard input conditioning. With a compact design and military-grade temperature tolerance, this product ensures reliable operation in demanding environments. Trust Texas Instruments to deliver innovative solutions that provide value, benefits, and advantages to meet your unique needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a lightweight and durable housing for the product.

Propagation Delay At Nominal Supply: 12 ns

Low propagation delay ensures quick response time in decoding and driving operations.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making integration into existing systems straightforward.

Maximum I (ol): 24 Amp

Capable of driving high current loads, suitable for a variety of applications.

Minimum Operating Temperature: -55 °C

Can operate in extreme low-temperature environments, enhancing versatility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable performance.

Maximum Seated Height: 1.75 mm

Compact design, suitable for space-constrained applications.

Technical Specifications

Decoder & Drivers CD74ACT138MG4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS

Family:

ACT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74ACT138MG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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