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SN74LVC139APWR

Texas Instruments

SN74LVC139APWR by Texas Instruments

SN74LVC139APWR by Texas Instruments is a CMOS decoder with 4 bits and 2 functions. It has a propagation delay of 6.2 ns at 1.8V, making it ideal for industrial applications requiring fast response times. With a small outline package style and surface mount capability, it offers high performance in compact designs.

Median Price

$0.597

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

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Texas Instruments

USA . 13,213 parts In-Stock

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Arrow

USA . 1,904 parts In-Stock

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Newark

USA . 830 parts In-Stock

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DigiKey

USA . 3,015 parts In-Stock

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Mouser Electronics

USA . 2,123 parts In-Stock

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Farnell

UK . 630 parts In-Stock

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Element14

Singapore . 275 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Digiode

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Chip Stock

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Sensible Micro Corp

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Speed Components Ltd

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Vyrian

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Quantum Digital Technology

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Cyclops Electronics Ltd

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Rebound Electronics

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SPM Sales

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Semtec, LLC

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Prism Electronics

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PC Components Company LLC

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Bristol Electronics

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Connector Distribution Corp

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Right Parts Inc.

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EMSNET

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ECAB

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Atlantic Semiconductor

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Odintec Ltd.

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Semicontronic

India . 4,013 parts In-Stock

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Ampacity Inc.

Singapore . 3,625 parts In-Stock

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Argo Parts USA

USA . 3,876 parts In-Stock

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Corphita

USA . 4,574 parts In-Stock

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Continental Prestige Electronics

USA . 1,155 parts In-Stock

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Microchip USA

USA . 4,899 parts In-Stock

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Parana Technologies

USA . 554 parts In-Stock

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DigiPath Technology Company

USA . 980 parts In-Stock

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ChromeModa Solutions

Germany . 976 parts In-Stock

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IDEA Electronic Components Group

UK . 889 parts In-Stock

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Corohmni

South Africa . 28 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

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Computer Components Inc. - USA

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Netroflash

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Overview

Elevate your electronic designs with the SN74LVC139APWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and innovation in the Decoder & Drivers category. With its fast propagation delay, low power consumption, and versatile applications, this product is a game-changer for your projects. Experience the value and benefits of this decoder, from its compact design to its reliable performance. Trust Texas Instruments to take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Propagation Delay At Nominal Supply: 6.2 ns

With a fast propagation delay, this product ensures quick and efficient signal processing.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of devices and circuits.

No. of Functions: 2

Having multiple functions in a single component increases flexibility and functionality in circuit design.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement and organization on circuit boards.

No. of Bits: 4

Having 4 bits allows for a higher range of values to be represented, increasing the versatility of the product.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage reduces power consumption and heat generation.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable operation and signal integrity.

Power Supplies (V): 3.3

Compatible with common power supply voltages, making it easy to integrate into existing systems.

No. of Terminals: 16

Having 16 terminals allows for a wide range of connections and configurations.

Maximum I (ol): 24 Amp

With a high output current capacity, this product can drive demanding loads effectively.

Propagation Delay (tpd): 20.6 ns

The specified propagation delay ensures precise timing in signal processing applications.

Maximum Operating Temperature: 85 °C

The wide operating temperature range makes this product suitable for various environments and applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in harsh conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Maximum Seated Height: 1.2 mm

The low profile design allows for compact and space-efficient circuit layouts.

Width: 4.4 mm

The compact width enables efficient use of space on circuit boards.

Output Polarity: INVERTED

Having inverted output polarity can simplify circuit design and compatibility with other components.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand peak reflow temperatures for a sufficient duration during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering during assembly.

Length: 5 mm

The compact length allows for flexible placement and design in circuit layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, ensuring durability and reliability in harsh conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for efficient signal processing.

Terminal Form: GULL WING

The gull-wing terminal form provides secure connections and ease of soldering during assembly.

Packing Method: TR

Tray packaging method ensures safe transportation and storage of the product.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting on circuit boards.

Maximum Supply Voltage (Vsup): 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power sources.

Maximum Power Supply Current (ICC): 0.04 mA

Low power supply current consumption for energy-efficient operation.

Technical Specifications

Decoder & Drivers SN74LVC139APWR attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

20.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74LVC139APWR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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