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HEF4555BT

NXP Semiconductors

HEF4555BT by NXP Semiconductors

HEF4555BT by NXP Semiconductors is a CMOS Decoder & Drivers with 2 functions, 295 ns propagation delay at 5V. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package style. Ideal for applications requiring true output polarity control and dual terminal position.

Median Price

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Lifecycle Status

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South Africa . 658 parts In-Stock

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AZTECH Wire

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Overview

Enhance your electronic projects with the HEF4555BT by NXP Semiconductors, a high-quality Decoder & Drivers component that offers exceptional performance and reliability. With a nominal supply voltage of 5V and maximum I (ol) of 0.36 Amp, this small outline package delivers efficient operation and quick propagation delays. Perfect for industrial applications, this versatile product is designed to meet your needs while providing value and convenience. Upgrade your designs today with the HEF4555BT and experience the difference in quality that NXP Semiconductors brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the decoder & drivers, ensuring a longer lifespan of the product.

Propagation Delay At Nominal Supply: 295 ns

Low propagation delay ensures efficient and quick signal processing, making the product suitable for time-sensitive applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation of the decoder & drivers on PCBs, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V supply voltage, making it easy to integrate into existing systems without the need for additional power sources.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the decoder & drivers energy-efficient and reliable in various operating conditions.

Maximum Operating Temperature: 85 °C

Can operate efficiently at higher temperatures, ensuring reliable performance in industrial environments with increased heat levels.

Technical Specifications

Decoder & Drivers HEF4555BT attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.36 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

295 ns

Propagation Delay (tpd):

230 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

HEF4555BT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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