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CD74HCT138EE4

Texas Instruments

CD74HCT138EE4 by Texas Instruments

CD74HCT138EE4 by Texas Instruments is a CMOS decoder with 16 terminals and inverted output polarity. It operates at a supply voltage of 5V, has a propagation delay of 53ns, and can handle a load capacitance of 50pF. This military-grade device is ideal for applications requiring standard input conditioning in electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,313 parts In-Stock

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Digiode

USA . 3,478 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Parana Technologies

USA . 692 parts In-Stock

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$7.777

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$8.322

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DigiPath Technology Company

USA . 1,886 parts In-Stock

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$8.563

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ChromeModa Solutions

Germany . 3,701 parts In-Stock

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$8.738

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IDEA Electronic Components Group

UK . 42 parts In-Stock

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$7.864

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Ampacity Inc.

Singapore . 1,101 parts In-Stock

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AZTECH Wire

Italy . 288 parts In-Stock

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Corohmni

South Africa . 150 parts In-Stock

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One Stop Electronics

USA . 1,638 parts In-Stock

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Semicontronic

India . 682 parts In-Stock

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Continental Prestige Electronics

USA . 6,158 parts In-Stock

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Corphita

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Argo Parts USA

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Bastille Electronics

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Overview

Unlock the power of efficient signal decoding with the Texas Instruments CD74HCT138EE4. Manufactured by a trusted industry leader, this decoder and driver offers high-quality performance and reliability for a wide range of applications. With its fast propagation delay and low power consumption, this versatile component provides exceptional value to customers seeking precision and efficiency in their designs. Trust Texas Instruments to deliver cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 53 ns

Low propagation delay ensures fast response times, making this product suitable for applications requiring quick signal processing.

Input Conditioning: STANDARD

Standard input conditioning makes it compatible with a wide range of input signals, increasing its versatility.

Nominal Supply Voltage / Vsup (V): 5

Operates at a commonly used supply voltage, making it easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

Suitable for driving loads with capacitance up to 50 pF, providing flexibility in design.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures, ensuring reliability in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Decoder & Drivers CD74HCT138EE4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE LOW AND ONE ACTIVE HIGH ENABLE INPUTS

Family:

HCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

53 ns

Propagation Delay (tpd):

53 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD74HCT138EE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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