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74AC139PC

Onsemi

74AC139PC by Onsemi

74AC139PC by Onsemi is a CMOS decoder with 2 functions, 13ns propagation delay, and inverted output polarity. It operates at a supply voltage of 3.3V and has a max operating temperature of 85°C. Ideal for industrial applications requiring fast decoding with low power consumption.

Median Price

$0.396

Lifecycle Status

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34

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1k+

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Rochester

USA . 23,713 parts In-Stock

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$0.396

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$0.329

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$0.293

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DigiKey

USA . 23,713 parts In-Stock

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Verical

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Nova Conductors

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Digiode

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DigiKey Marketplace

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Vyrian

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Semi Source

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Bristol Electronics

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Inventory MP

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MRC Electronics

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Connector Distribution Corp

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Elcom Components

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Continental Prestige Electronics

USA . 5,135 parts In-Stock

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Argo Parts USA

USA . 4,372 parts In-Stock

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Netroflash

USA . 999 parts In-Stock

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Corphita

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Corohmni

South Africa . 71 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Metaverse IC Inc.

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Kulean Microsystems

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Microchip USA

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Glotronic Ltd.

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Problanco Electronics

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SupplyDigital Components

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Cyclops Electronics Ltd (Excess)

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Overview

Enhance your electronic projects with the 74AC139PC by Onsemi, a top-tier manufacturer known for producing high-quality decoder and drivers. This versatile component offers customers unparalleled value and benefits, with a fast propagation delay of just 13ns, dual functions, and an inverted output polarity. Ideal for industrial applications, this product boasts a wide operating temperature range and a compact rectangular package style, making it a must-have for any project requiring precision and reliability. Elevate your designs with the innovative technology and superior performance of the 74AC139PC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product long-lasting.

Propagation Delay At Nominal Supply: 13 ns

With a fast propagation delay, this product ensures quick response times in decoding and driving operations.

No. of Functions: 2

Having multiple functions in one unit saves space and simplifies circuit design.

Package Shape: RECTANGULAR

The rectangular shape is easy to integrate into various setups and layouts, offering flexibility in installation.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common supply voltage of 3.3V makes it compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

The ability to handle a load capacitance of 50pF ensures stability and reliability in signal transmission.

Power Supplies (V): 3.3/5

Support for multiple power supplies allows for compatibility with different voltage sources.

No. of Terminals: 16

With 16 terminals, this product offers ample connection options for various input and output configurations.

Package Style (Meter): IN-LINE

The in-line package style is space-efficient and easy to integrate into compact designs.

Maximum I (ol): 12 Amp

With a high maximum output current of 12A, this product can drive more demanding loads effectively.

Propagation Delay (tpd): 11 ns

A low propagation delay of 11ns ensures minimal signal delay and fast response times.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85°C ensures reliability even in high-temperature environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product is suitable for use in a wide range of conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal positions offer flexibility in installation and connectivity options.

Maximum Seated Height: 5.08 mm

With a low seated height, this product is suitable for compact applications with limited space.

Width: 7.62 mm

The compact width of 7.62mm allows for easy integration into tight spaces or crowded PCB layouts.

Output Polarity: INVERTED

Inverted output polarity allows for compatibility with a wide range of systems and signal requirements.

Minimum Supply Voltage (Vsup): 2 V

Operating at a minimum supply voltage of 2V ensures compatibility with low-power systems.

Length: 19.305 mm

The length of 19.305mm provides a compact footprint while offering sufficient space for terminal connections.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade temperature requirements, this product is suitable for rugged environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical connections, ensuring stability and durability in a variety of applications.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54mm allows for easy PCB mounting and compatibility with common connection methods.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6V, this product can handle higher voltage inputs, providing flexibility in system design.

Technical Specifications

Decoder & Drivers 74AC139PC attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

AC

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74AC139PC Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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