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HEF4555BP

NXP Semiconductors

HEF4555BP by NXP Semiconductors

HEF4555BP by NXP Semiconductors is a CMOS Decoder & Drivers with 2 functions, 295 ns propagation delay at 5V. Ideal for industrial applications, it operates b/w -40 to 85°C with a load capacitance of 50 pF and max supply voltage of 15V.

Median Price

$0.594

Lifecycle Status

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20

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Nova Conductors

Japan . 10 parts In-Stock

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Inland Empire Components Inc.

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LIBRA Elektronik GmbH

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LittleDiode

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Holdelec - ElecDif-Pro

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Continental Prestige Electronics

USA . 881 parts In-Stock

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Argo Parts USA

USA . 122 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Ampacity Inc.

Singapore . 132 parts In-Stock

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Corohmni

South Africa . 262 parts In-Stock

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Aztec Data Supply Inc.

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Semicontronic

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One Stop Electronics

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Overview

Elevate your electronics projects with the NXP Semiconductors HEF4555BP Decoder & Drivers. This high-quality product offers exceptional performance and reliability, thanks to the renowned manufacturer's commitment to excellence. With a wide range of applications in digital systems, this decoder provides seamless integration and efficient operation. Trust in the value, benefits, and advantages that the HEF4555BP brings to your designs, making it a must-have component for any electronic enthusiast or professional. Upgrade your projects today with the HEF4555BP by NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, ensuring reliable performance over time.

Propagation Delay At Nominal Supply: 295 ns

The low propagation delay at nominal supply voltage ensures fast response times and efficient operation of the decoder & drivers.

No. of Functions: 2

Having two functions allows for versatile usage and increased flexibility in decoding and driving processes.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common nominal supply voltage of 5V makes it compatible with many standard electronic systems and power sources.

Maximum Seated Height: 4.7 mm

The compact maximum seated height makes this product suitable for applications where space is limited, enabling efficient installation in various devices.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Technical Specifications

Decoder & Drivers HEF4555BP attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

21.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.36 Amp

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

295 ns

Propagation Delay (tpd):

230 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HEF4555BP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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