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CD74HCT238M96E4

Texas Instruments

CD74HCT238M96E4 by Texas Instruments

CD74HCT238M96E4 by Texas Instruments is a 16-terminal decoder with a propagation delay of 53ns at 5V, suitable for military-grade applications. It features a max operating temperature of 125°C, true output polarity, and standard input conditioning. This CMOS technology device has a small outline package style and is surface mountable.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,805 parts In-Stock

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Vyrian

USA . 2,790 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Ampacity Inc.

Singapore . 922 parts In-Stock

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$10.000

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922

$10.000

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Corohmni

South Africa . 33 parts In-Stock

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$10.340

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AZTECH Wire

Italy . 195 parts In-Stock

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$11.021

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Parana Technologies

USA . 672 parts In-Stock

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$14.365

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DigiPath Technology Company

USA . 1,436 parts In-Stock

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$15.289

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ChromeModa Solutions

Germany . 4,100 parts In-Stock

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IDEA Electronic Components Group

UK . 378 parts In-Stock

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$14.821

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$14.041

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One Stop Electronics

USA . 1,329 parts In-Stock

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Argo Parts USA

USA . 4,493 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Aranea Global

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Overview

Discover unparalleled quality and reliability with the Texas Instruments CD74HCT238M96E4. As a leading manufacturer in the industry, Texas Instruments delivers top-notch decoder & driver solutions for a wide range of applications. With a fast propagation delay and high load capacitance, this product ensures optimal performance in all scenarios. Designed for ease of use and efficiency, the CD74HCT238M96E4 offers true output polarity and standard input conditioning, making it a versatile and valuable choice for customers seeking dependable solutions. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the decoder and drivers, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 53 ns

Fast propagation delay ensures quick response times for the decoder and drivers, making them efficient in processing signals.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level of 5V, making it compatible with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

Suitable load capacitance for efficient performance and signal processing in various applications.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, ideal for industrial and harsh environments.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation in extreme cold conditions, increasing the versatility of this product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the decoder and drivers energy efficient and reliable.

Technical Specifications

Decoder & Drivers CD74HCT238M96E4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE LOW AND ONE ACTIVE HIGH ENABLE INPUTS

Family:

HCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

53 ns

Propagation Delay (tpd):

53 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HCT238M96E4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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