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HEF4511BT

NXP Semiconductors

HEF4511BT by NXP Semiconductors

HEF4511BT by NXP Semiconductors is a CMOS Decoder & Driver with 16 terminals and latch input conditioning. Operating at -40 to 125 °C, it has a propagation delay of 310 ns and supports a supply voltage range of 3-15 V. Ideal for automotive applications, this small outline package offers true output polarity and peak reflow temperature of 260C.

Median Price

$0.128

Lifecycle Status

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Nova Conductors

Japan . 50 parts In-Stock

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LIBRA Elektronik GmbH

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Bastille Electronics

Australia . 4,212 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Overview

Unlock the power of innovation with the HEF4511BT by NXP Semiconductors, a leading name in semiconductor technology. This decoder & driver offers unmatched quality and reliability, making it an essential component for a wide range of applications. From automotive to industrial, this versatile product ensures seamless operation and optimal performance. Experience the value of cutting-edge technology and the benefits of precision engineering with the HEF4511BT, setting new standards in efficiency and durability. Elevate your projects with NXP Semiconductors and discover the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring longevity of the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Input Conditioning: LATCHED

Ensures stable and reliable input signals, reducing the risk of errors or malfunctions in decoding operations.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common voltage levels in electronic circuits, making it versatile and widely usable.

Propagation Delay (tpd): 310 ns

Provides fast response times for decoding and driving signals, enhancing overall performance.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications, meeting the required standards for temperature ranges and durability in vehicle environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Decoder & Drivers HEF4511BT attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Additional Features:

BLANKING INPUT; LAMP TEST INPUT; LED DISPLAY DRIVER; IOH = 20MA @ VOH = 2.5V

Family:

4000/14000/40000

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

310 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

HEF4511BT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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