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SN54ALS538FH-00

Texas Instruments

SN54ALS538FH-00 by Texas Instruments

SN54ALS538FH-00 by Texas Instruments is a 20-terminal decoder & driver chip in a square ceramic package. Operating b/w -55 to 125°C, it supports a supply voltage range of 4.5V to 5.5V with configurable output polarity and TTL technology, making it ideal for military-grade applications requiring 3-STATE output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,679 parts In-Stock

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3,679

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Vyrian

USA . 3,606 parts In-Stock

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3,606

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 335 parts In-Stock

1+ parts

$5.883

100+ parts

-

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335

$5.883

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Parana Technologies

USA . 345 parts In-Stock

1+ parts

$27.188

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-

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$33.089

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345

$27.188

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$33.089

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DigiPath Technology Company

USA . 876 parts In-Stock

1+ parts

$29.937

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876

$29.937

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ChromeModa Solutions

Germany . 3,001 parts In-Stock

1+ parts

$30.548

100+ parts

$25.049

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3,001

$30.548

$25.049

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IDEA Electronic Components Group

UK . 298 parts In-Stock

1+ parts

$30.548

100+ parts

$29.021

1k+ parts

$27.493

10k+ parts

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298

$30.548

$29.021

$27.493

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One Stop Electronics

USA . 1,441 parts In-Stock

1+ parts

$33.000

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1,441

$33.000

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Corphita

USA . 2,138 parts In-Stock

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Overview

Elevate your circuit design with the SN54ALS538FH-00 by Texas Instruments, a premier manufacturer known for top-quality components. This decoder & driver chip offers unparalleled reliability and performance, making it ideal for a wide range of applications. With its configurable output polarity and 3-state output characteristics, this versatile chip provides flexibility and efficiency in your projects. Trust Texas Instruments to deliver value and innovation in every product, ensuring that you always get the best results. Reach new heights in your designs with the SN54ALS538FH-00.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures high durability and reliability for the product, making it suitable for long-term use in various conditions.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into circuit boards, saving time and effort during manufacturing.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a common standard in many electronic devices, making this product compatible with a wide range of applications.

Output Characteristics: 3-STATE

The 3-state output allows for greater flexibility in controlling multiple signals, improving overall system functionality.

Temperature Grade: MILITARY

This product is designed to operate reliably in harsh environmental conditions, making it suitable for military and aerospace applications.

Technology: TTL

The TTL technology provides fast and reliable signal processing, ensuring high performance and accuracy in data transmission.

Technical Specifications

Decoder & Drivers SN54ALS538FH-00 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

CONFIGURABLE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SN54ALS538FH-00 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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