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SN54156W-00

Texas Instruments

SN54156W-00 by Texas Instruments

SN54156W-00 by Texas Instruments is a TTL decoder with 2 functions, 16 terminals, and open-collector output. It operates b/w -55 to 125 °C with a supply voltage range of 4.5V to 5.5V. Ideal for military-grade applications requiring fast propagation delay of 34ns in a compact flatpack package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,558 parts In-Stock

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8,558

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Digiode

USA . 2,056 parts In-Stock

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2,056

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,713 parts In-Stock

1+ parts

$14.440

100+ parts

-

1k+ parts

$14.879

10k+ parts

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1,713

$14.440

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$14.879

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DigiPath Technology Company

USA . 1,466 parts In-Stock

1+ parts

$15.900

100+ parts

$14.628

1k+ parts

-

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1,466

$15.900

$14.628

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IDEA Electronic Components Group

UK . 627 parts In-Stock

1+ parts

$16.225

100+ parts

$15.414

1k+ parts

$14.602

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627

$16.225

$15.414

$14.602

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ChromeModa Solutions

Germany . 197 parts In-Stock

1+ parts

$16.225

100+ parts

$13.304

1k+ parts

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197

$16.225

$13.304

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AZTECH Wire

Italy . 262 parts In-Stock

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$19.207

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262

$19.207

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One Stop Electronics

USA . 529 parts In-Stock

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$50.000

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529

$50.000

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Corphita

USA . 2,262 parts In-Stock

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2,262

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Overview

Unlock the power of precision with the Texas Instruments SN54156W-00 Decoder & Drivers. Crafted with top-notch quality and cutting-edge technology, this product boasts unrivaled performance and reliability for a wide range of applications. From military-grade temperature tolerance to true output polarity, this decoder delivers superior functionality that exceeds expectations. Elevate your projects with the SN54156W-00 and experience the seamless integration, efficiency, and value that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed materials ensures that the package is durable and can withstand high temperatures, making it suitable for rugged environments.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard electronic systems, providing ease of integration.

Propagation Delay (tpd): 34 ns

With a low propagation delay of 34ns, this product allows for fast and efficient signal processing, ideal for applications requiring quick response times.

Output Characteristics: OPEN-COLLECTOR

The open-collector output characteristics allow for easy interfacing with other devices and components, enhancing overall system flexibility.

Technology: TTL

Utilizing TTL technology ensures high-speed and reliable signal transmission, making this product suitable for applications where timing and precision are critical.

Technical Specifications

Decoder & Drivers SN54156W-00 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

FUNCTION 2 OUTPUT INVERTED

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F16

Length:

10.2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

35 mA

Propagation Delay (tpd):

34 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.73 mm

Trade Compliance

SN54156W-00 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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