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CD74AC138MG4

Texas Instruments

CD74AC138MG4 by Texas Instruments

CD74AC138MG4 by Texas Instruments is a 16-terminal decoder with 15.4ns propagation delay at 3.3V, ideal for military applications. It features inverted output polarity, CMOS technology, and operates b/w -55 to 125 °C. The package is small outline with surface mount capability and nickel palladium gold terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Adafruit Industries

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Vyrian

USA . 6,764 parts In-Stock

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Digiode

USA . 4,343 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Parana Technologies

USA . 605 parts In-Stock

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$7.860

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$8.417

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605

$7.860

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$8.417

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AZTECH Wire

Italy . 873 parts In-Stock

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$8.318

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DigiPath Technology Company

USA . 940 parts In-Stock

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$8.655

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$8.655

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ChromeModa Solutions

Germany . 1,942 parts In-Stock

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$8.832

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$7.242

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IDEA Electronic Components Group

UK . 853 parts In-Stock

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$8.832

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$8.390

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$7.949

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853

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Ampacity Inc.

Singapore . 90 parts In-Stock

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$12.000

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Corohmni

South Africa . 22 parts In-Stock

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$19.501

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Argo Parts USA

USA . 3,570 parts In-Stock

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Continental Prestige Electronics

USA . 1,691 parts In-Stock

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Corphita

USA . 385 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Advanced Electronics

New Zealand . 90 parts In-Stock

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Overview

Unlock the power of precision with the CD74AC138MG4 by Texas Instruments, a top-of-the-line decoder and driver that promises unparalleled reliability and performance. Manufactured with the highest quality materials and cutting-edge technology, this versatile component is perfect for a wide range of applications. From industrial automation to consumer electronics, this compact yet powerful device offers fast propagation delay and inverted output polarity, making it a must-have for any project. Trust Texas Instruments for superior products that deliver maximum value and benefits to customers looking for top-notch quality and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and resistance to heat, making the product suitable for various operating conditions.

Propagation Delay At Nominal Supply: 15.4 ns

Low propagation delay ensures fast response time, making the product efficient for decoding and driving operations.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard voltage of 3.3V, this product is compatible with common power supplies in many electronic systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and extended operation without failure.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, enhancing the reliability and efficiency of the product.

Technical Specifications

Decoder & Drivers CD74AC138MG4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS

Family:

AC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

15.4 ns

Propagation Delay (tpd):

138 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74AC138MG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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