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SN54156J-00

Texas Instruments

SN54156J-00 by Texas Instruments

SN54156J-00 by Texas Instruments is a TTL decoder with 2 functions, 16 terminals, and open-collector output. It operates b/w -55 to 125 °C, with a propagation delay of 34 ns at Vsup of 5V. Ideal for military-grade applications requiring fast signal decoding in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,684 parts In-Stock

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Digiode

USA . 4,221 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 2,275 parts In-Stock

1+ parts

$7.358

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$7.851

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$7.358

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$7.851

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DigiPath Technology Company

USA . 461 parts In-Stock

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$8.102

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$7.454

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461

$8.102

$7.454

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ChromeModa Solutions

Germany . 5,821 parts In-Stock

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$8.267

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$6.779

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$8.267

$6.779

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IDEA Electronic Components Group

UK . 1,262 parts In-Stock

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$8.267

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$7.440

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1,262

$8.267

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$7.440

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AZTECH Wire

Italy . 432 parts In-Stock

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$17.394

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$17.394

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One Stop Electronics

USA . 1,431 parts In-Stock

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$48.000

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Corphita

USA . 2,558 parts In-Stock

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Overview

Unlock the power of precision with the SN54156J-00 by Texas Instruments. This top-tier decoder and driver boasts unparalleled quality from a trusted manufacturer, making it the ideal choice for a wide range of applications. With its ceramic, glass-sealed body and open-collector output characteristics, this product guarantees reliability and efficiency in any project. Experience the value and benefits that come with choosing Texas Instruments for your decoding needs – trust in excellence, trust in SN54156J-00.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed package provides durability and protection, making the product suitable for industrial applications.

No. of Functions: 2

Having multiple functions in one component saves space and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage ensures compatibility with most systems and ease of integration.

Propagation Delay (tpd): 34 ns

Low propagation delay ensures fast response time and high performance.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for easy interfacing with different types of loads and devices.

Temperature Grade: MILITARY

Military-grade temperature range ensures operation in harsh environments and reliable performance under extreme conditions.

Technology: TTL

TTL technology offers high speed, low power consumption, and compatibility with a wide range of digital systems.

Technical Specifications

Decoder & Drivers SN54156J-00 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

FUNCTION 2 OUTPUT INVERTED

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

35 mA

Propagation Delay (tpd):

34 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN54156J-00 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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