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74HCT4514DB,112

NXP Semiconductors

74HCT4514DB,112 by NXP Semiconductors

NXP Semiconductors' 74HCT4514DB,112 is a CMOS Decoder & Drivers with 69ns Propagation Delay and 5V Nominal Voltage. LATCHED Input Conditioning makes it ideal for automotive applications requiring TRUE Output Polarity in a SMALL OUTLINE package.

Median Price

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Lifecycle Status

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5

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1k+

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Vyrian

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AZTECH Wire

Italy . 12,780 parts In-Stock

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Ampacity Inc.

Singapore . 413 parts In-Stock

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One Stop Electronics

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Microchip USA

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Overview

Looking for a high-quality Decoder & Driver from a reputable manufacturer? Look no further than the 74HCT4514DB,112 by NXP Semiconductors. This versatile product offers quick propagation delay, surface mount capability, and latched input conditioning. Perfect for automotive applications, this decoder promises reliable performance and ease of use. Upgrade your projects with the value and benefits that only NXP Semiconductors can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this decoder & driver lightweight and durable.

Propagation Delay At Nominal Supply: 69 ns

With a fast propagation delay at nominal supply voltage, this product ensures quick and efficient decoding and driving operations.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving on PCBs.

Input Conditioning: LATCHED

Latched input conditioning provides stable and reliable input signals for accurate decoding and driving.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact and practical design for easy integration into electronic systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage, this decoder & driver is compatible with a wide range of applications.

Load Capacitance (CL): 50 pF

With a low load capacitance, this product ensures minimal signal distortion and enhanced performance.

Power Supplies (V): 5

The availability of multiple power supplies at 5V ensures stable and reliable operation.

No. of Terminals: 24

The 24 terminals provide ample connectivity options for various input and output requirements.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style offers a space-efficient and streamlined design for compact electronic devices.

Technical Specifications

Decoder & Drivers 74HCT4514DB,112 attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Additional Features:

ADDRESS LATCHES

Family:

HCT

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

69 ns

Propagation Delay (tpd):

83 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

74HCT4514DB,112 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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